公开(公告)号：US20230178452A1

公开(公告)日：2023-06-08

申请号：US17828039

申请日：2022-05-31

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Liang-Lu Chen ,  Kuang-Ming Fan ,  Chia-Lin Yang ,  Chun-Hung Chen

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L21/66

CPC classification number: H01L23/3677 ,  H01L21/4882 ,  H01L22/32 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2924/3511 ,  H01L2924/30105 ,  H01L2924/35121

Abstract: An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a connector, an electronic component, and a heat sink. The connector has at least one conductive structure and at least one first heat dissipation structure. The at least one conductive structure and the at least one first heat dissipation structure are physically separated and electrically insulated from each other. The electronic component is electrically connected to the at least one conductive structure. The heat sink is connected to the at least one first heat dissipation structure. The heat sink and the electronic component are disposed on opposite sides of the connector.

公开(公告)号：US20250157826A1

公开(公告)日：2025-05-15

申请号：US19023380

申请日：2025-01-16

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Chia-Lin Yang ,  Liang-Lu Chen

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/498

Abstract: An electronic device is provided and includes a chip and a connector electrically connected to the chip, in which the connector includes a conductive layer, a first insulating layer, and a second insulating layer, the conductive layer is disposed between the first insulating layer and the second insulating layer, the first insulating layer has a first transmittance for a light, the second insulating layer has a second transmittance for the light, and the first transmittance is different from the second transmittance.

公开(公告)号：US12237176B2

公开(公告)日：2025-02-25

申请号：US17736997

申请日：2022-05-04

Applicant: InnoLux Corporation

Inventor： Kuang-Ming Fan ,  Chia-Lin Yang ,  Liang-Lu Chen

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/498

Abstract: An electronic device includes a conductive layer, a first dielectric layer, and a second dielectric layer, in which the second dielectric layer is disposed on the first dielectric layer, the conductive layer is disposed between the first dielectric layer and the second dielectric layer, the first dielectric layer has a first transmittance for a light, the second dielectric layer has a second transmittance for the light, and the first transmittance is different from the second transmittance.

公开(公告)号：US20240130040A1

公开(公告)日：2024-04-18

申请号：US18462434

申请日：2023-09-07

Applicant: Innolux Corporation

Inventor： Ker-Yih Kao ,  Kuang-Ming Fan ,  Chia-Lin Yang ,  Jui-Jen Yueh ,  Ju-Li Wang

IPC: H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0296 ,  H05K3/28 ,  H05K2201/09063

Abstract: Disclosed are a conductive film and a test component. A conductive film includes a supporting layer, a circuit layer and a protective layer. The supporting layer has a first surface and a second surface opposite to the first surface. The supporting layer supports the circuit layer. The circuit layer includes a first protruding part, a second protruding part and a connecting part. The first protruding part is disposed on the first surface. The second protruding part is disposed on the second surface. The connecting part is disposed between the first protruding part and the second protruding part. The first protruding part is connected to the second protruding part through the connecting part. The protective layer covers the first protruding part. The conductive film and the test component of the disclosed embodiments may have a buffering effect or increase the service life.

公开(公告)号：US12185461B2

公开(公告)日：2024-12-31

申请号：US18073592

申请日：2022-12-02

Applicant: InnoLux Corporation

Inventor： Cheng-Chi Wang ,  Chin-Ming Huang ,  Chien-Feng Li ,  Chia-Lin Yang

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.