公开(公告)号：US20230050743A1

公开(公告)日：2023-02-16

申请号：US17510403

申请日：2021-10-26

Applicant: Innolux Corporation

Inventor： Chih-Yuan Hsu ,  Kuang-Ming Fan ,  Wen-Hsiang Liao

IPC: H01L21/66

Abstract: A method for manufacturing an electronic device is provided, the method includes: providing an inspection module to inspect a first area of the electronic device to obtain a first information and inspect a second area of the electronic device to obtain a second information; transmitting the first information and the second information to a processing system; comparing the first information and the second information to obtain a difference; and transmitting a correction information to a first process machine via a first interface system. When the difference is greater than or equal to -2 and less than or equal to 2, the first process machine is started to produce. An electronic device is also provided.

公开(公告)号：US12300556B2

公开(公告)日：2025-05-13

申请号：US17510403

申请日：2021-10-26

Applicant: Innolux Corporation

Inventor： Chih-Yuan Hsu ,  Kuang-Ming Fan ,  Wen-Hsiang Liao

IPC: G03F7/20 ,  H01L21/66

Abstract: A method for manufacturing an electronic device is provided, the method includes: providing an inspection module to inspect a first area of the electronic device to obtain a first information and inspect a second area of the electronic device to obtain a second information; transmitting the first information and the second information to a processing system; comparing the first information and the second information to obtain a difference; and transmitting a correction information to a first process machine via a first interface system. When the difference is greater than or equal to −2 and less than or equal to 2, the first process machine is started to produce. An electronic device is also provided.

公开(公告)号：US20230117955A1

公开(公告)日：2023-04-20

申请号：US17746970

申请日：2022-05-18

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Ker-Yih Kao ,  Cheng-Chi Wang ,  Kuang-Ming Fan ,  Chun-Hung Chen ,  Wen-Hsiang Liao ,  Ming-Hsien Shih

IPC: H01L23/00 ,  H01L21/469

Abstract: An electronic device including a connection element is provided. The connection element includes a first metal layer, a first insulation layer, and a second insulation layer. The first insulation layer is disposed on the first metal layer and has a first hole and a second hole. The second insulation layer is disposed on the first insulation layer. The first hole exposes a portion of the first metal layer, and the second insulation layer extends into the second hole. A method of fabricating an electronic device is also provided.

公开(公告)号：US11966133B2

公开(公告)日：2024-04-23

申请号：US18319622

申请日：2023-05-18

Applicant: InnoLux Corporation

Inventor： Tai-Chi Pan ,  Chin-Lung Ting ,  I-Chang Liang ,  Chih-Chiang Chang Chien ,  Po-Wen Lin ,  Kuang-Ming Fan ,  Sheng-Nan Chen

IPC: G02F1/1362 ,  G02F1/13 ,  G02F1/1335 ,  G02F1/1337

CPC classification number: G02F1/136259 ,  G02F1/1309 ,  G02F1/133504 ,  G02F1/133516 ,  G02F1/133562 ,  G02F1/133788 ,  G02F1/133528

Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

公开(公告)号：US20230129218A1

公开(公告)日：2023-04-27

申请号：US17746987

申请日：2022-05-18

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Ker-Yih Kao ,  Cheng-Chi Wang ,  Kuang-Ming Fan ,  Chun-Hung Chen ,  Wen-Hsiang Liao ,  Ming-Hsien Shih

IPC: H01L23/00

Abstract: An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

公开(公告)号：US12253776B2

公开(公告)日：2025-03-18

申请号：US18615105

申请日：2024-03-25

Applicant: InnoLux Corporation

Inventor： Tai-Chi Pan ,  Chin-Lung Ting ,  I-Chang Liang ,  Chih-Chiang Chang Chien ,  Po-Wen Lin ,  Kuang-Ming Fan ,  Sheng-Nan Chen

IPC: G02F1/1362 ,  G02F1/13 ,  G02F1/1335 ,  G02F1/1337

Abstract: A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

公开(公告)号：US12237176B2

公开(公告)日：2025-02-25

申请号：US17736997

申请日：2022-05-04

Applicant: InnoLux Corporation

Inventor： Kuang-Ming Fan ,  Chia-Lin Yang ,  Liang-Lu Chen

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/498

Abstract: An electronic device includes a conductive layer, a first dielectric layer, and a second dielectric layer, in which the second dielectric layer is disposed on the first dielectric layer, the conductive layer is disposed between the first dielectric layer and the second dielectric layer, the first dielectric layer has a first transmittance for a light, the second dielectric layer has a second transmittance for the light, and the first transmittance is different from the second transmittance.

公开(公告)号：US20240130040A1

公开(公告)日：2024-04-18

申请号：US18462434

申请日：2023-09-07

Applicant: Innolux Corporation

Inventor： Ker-Yih Kao ,  Kuang-Ming Fan ,  Chia-Lin Yang ,  Jui-Jen Yueh ,  Ju-Li Wang

IPC: H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0296 ,  H05K3/28 ,  H05K2201/09063

Abstract: Disclosed are a conductive film and a test component. A conductive film includes a supporting layer, a circuit layer and a protective layer. The supporting layer has a first surface and a second surface opposite to the first surface. The supporting layer supports the circuit layer. The circuit layer includes a first protruding part, a second protruding part and a connecting part. The first protruding part is disposed on the first surface. The second protruding part is disposed on the second surface. The connecting part is disposed between the first protruding part and the second protruding part. The first protruding part is connected to the second protruding part through the connecting part. The protective layer covers the first protruding part. The conductive film and the test component of the disclosed embodiments may have a buffering effect or increase the service life.

公开(公告)号：US20230238252A1

公开(公告)日：2023-07-27

申请号：US17751643

申请日：2022-05-23

Applicant: Innolux Corporation

Inventor： Cheng-Chi Wang ,  Chien-Feng Li ,  Kuang-Ming Fan

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/568 ,  H01L24/19 ,  H01L23/293

Abstract: A manufacturing method of a package structure of an electronic device is provided. The manufacturing method includes the following. First, a carrier plate is provided. The carrier plate includes a composite structure and has a first surface and a second surface opposite to each other. Next, an anti-warpage structure is formed on the first surface of the carrier plate. Then, a redistribution structure is formed on the second surface of the carrier plate. When the package structure manufactured with the manufacturing method of the package structure of the electronic device of the disclosure is applied to the electronic device, reliability and/or electrical properties of the electronic device are enhanced.

公开(公告)号：US20250081333A1

公开(公告)日：2025-03-06

申请号：US18793961

申请日：2024-08-05

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Kuang-Ming Fan ,  Yi-Liang Chen ,  Lung-Shu Huang

IPC: H05K1/02 ,  H05K3/28

Abstract: Disclosed are an electronic device and a manufacturing method thereof. The electronic device includes a circuit structure and at least one contacting part. The at least one contacting part is disposed on the circuit structure, and includes an insulating part and a conductive layer. The conductive layer surrounds the insulating part, and the conductive layer is electrically connected to the circuit structure. The electronic device disclosed herein may have a buffering effect or reduce damage to an object to be detected.