公开(公告)号：US20240120304A1

公开(公告)日：2024-04-11

申请号：US17993905

申请日：2022-11-24

Applicant: Innolux Corporation

Inventor： Tzu-Sheng Wu ,  Haw-Kuen Liu ,  Chung-Jyh Lin ,  Cheng-Chi Wang ,  Wen-Hsiang Liao ,  Te-Hsun Lin

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L2224/034 ,  H01L2224/0362 ,  H01L2224/05005 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05082 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05573 ,  H01L2224/0603 ,  H01L2224/13005 ,  H01L2224/13082 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/17163 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.