SENSING DEVICE
    1.
    发明申请

    公开(公告)号:US20220327855A1

    公开(公告)日:2022-10-13

    申请号:US17688951

    申请日:2022-03-08

    Abstract: A sensing device includes a sensing circuit, a conductive line, and a sampling circuit. The conductive line is electrically connected to the sensing circuit. The sampling circuit is electrically connected to the conductive line. The sampling circuit includes a capacitor, a first thin film transistor, and a second thin film transistor. The first terminal of the first thin film transistor is electrically connected to the first terminal of the capacitor. The first terminal of the second thin film transistor is electrically connected to the second terminal of the capacitor. The second terminal of the first thin film transistor is electrically connected to the conductive line. The second terminal of the second thin film transistor is electrically connected to the ground terminal.

    SENSING DEVICE FOR IMPROVING THE SPEED OF IMAGE SENSING

    公开(公告)号:US20230179844A1

    公开(公告)日:2023-06-08

    申请号:US18050610

    申请日:2022-10-28

    CPC classification number: H04N23/50 G03B7/083

    Abstract: A sensing device is provided herein, which operates in a reset period, an exposure period, and a readout period. The sensing device includes a first transistor, a second transistor, a detection device, and a third transistor. The first transistor includes a control terminal and a first terminal. The second transistor is coupled to the first transistor and configured to set the voltage of the control terminal during the exposure period. The sensing device is coupled to the first transistor and configured to change the voltage of the control terminal during the exposure period. The third transistor is coupled to the first transistor and includes an output terminal outputting a sense signal from the first terminal during the readout period. The first transistor is an N-type transistor and the third transistor is a P-type transistor.

    SENSING DEVICE, AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240055454A1

    公开(公告)日:2024-02-15

    申请号:US18347338

    申请日:2023-07-05

    CPC classification number: H01L27/14623 H01L27/14612 H01L27/14685

    Abstract: A sensing device is provided. The sensing device includes a substrate, a circuit layer, a photosensitive element, a light-shielding layer, and a conductive layer. The circuit layer is disposed on the substrate. The photosensitive element is disposed on the substrate and is electrically connected to the circuit layer. The light-shielding layer is disposed on the photosensitive element and has an opening. The opening overlaps the photosensitive element. The conductive layer is disposed on the light-shielding layer. In addition, the conductive layer passes through the opening and is electrically connected to the photosensitive element. A method of manufacturing a sensing device is also provided.

    ELECTRONIC DEVICE AND METHOD FOR FABRICATING A TRANSDUCER IN THE ELECTRONIC DEVICE

    公开(公告)号:US20220234075A1

    公开(公告)日:2022-07-28

    申请号:US17546209

    申请日:2021-12-09

    Abstract: An electronic device is provided. The electronic device includes multiple transducer pixels. Each of the transducer pixels includes a sonic transducer, a demultiplexer electrically connected to the sonic transducer, a driving line electrically connected to the sonic transducer, a switching line electrically connected to the demultiplexer, and a reading line electrically connected to the demultiplexer. The driving line is used to provide a driving signal to the sonic transducer to emit sonic waves. The switching line is used to turn on the demultiplexer to output the sensing signal received by the sonic transducer to the reading line.

    ELECTRONIC DEVICE
    6.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20230268353A1

    公开(公告)日:2023-08-24

    申请号:US18153765

    申请日:2023-01-12

    CPC classification number: H01L27/124 H02J50/05 G06F3/044

    Abstract: An electronic device is provided. The electronic device includes a substrate, a first conductive layer disposed on the substrate, a planarization layer disposed on the first conductive layer, an electric element, and a second conductive layer disposed on the planarization layer. The first conductive layer and the second conductive layer include an output line and a control line, respectively. The electric element is used to produce a first signal. The electronic device further includes a switching element, which is used to receive the first signal and output the first signal to the output line according to a second signal of the control line. The output line and the control line partially overlap.

    APPARATUS FOR IDENTIFYING MORPHOLOGY
    7.
    发明申请
    APPARATUS FOR IDENTIFYING MORPHOLOGY 审中-公开
    识别形态学的装置

    公开(公告)号:US20150071323A1

    公开(公告)日:2015-03-12

    申请号:US14479834

    申请日:2014-09-08

    CPC classification number: G06K9/0002

    Abstract: An apparatus for identifying morphology comprises a substrate, a driving circuit, a readout circuit and an identifying circuit. The substrate comprises temperature sensors each comprising a sensing transistor. The driving circuit selects at least one of the transistors as a target sensing transistor, and outputs a driving signal to the target sensing transistor to heat the target sensing transistor in a heating period. The target sensing transistor senses a temperature change to generate a sensing signal in a sensing period after the heating period. The readout circuit reads the sensing signal, and the identifying circuit identifies the morphology according to the sensing signal.

    Abstract translation: 用于识别形态的装置包括基板,驱动电路,读出电路和识别电路。 基板包括各自包括感测晶体管的温度传感器。 驱动电路将至少一个晶体管选择为目标感测晶体管,并将驱动信号输出到目标感测晶体管,以在加热期间加热目标感测晶体管。 目标感测晶体管感测温度变化,以在加热周期之后的感测时段中产生感测信号。 读出电路读取感测信号,识别电路根据感测信号识别形态。

    CARD DEVICE AND METHOD FOR MANUFACTURING CARD DEVICE

    公开(公告)号:US20230325624A1

    公开(公告)日:2023-10-12

    申请号:US18121600

    申请日:2023-03-15

    CPC classification number: G06K19/077 G06K19/0717

    Abstract: A card device and a manufacturing method thereof are disclosed. The card device includes a first substrate, a circuit board, a sensing module and a second substrate. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing module is disposed in the accommodating recess. The sensing module includes a sensing unit and a protective layer formed on the sensing unit, and the sensing unit is electrically connected to the circuit board. The second substrate is disposed on the circuit board. The second substrate includes an opening, and the opening exposes the protective layer.

    SENSING DEVICE
    9.
    发明申请

    公开(公告)号:US20220321821A1

    公开(公告)日:2022-10-06

    申请号:US17688172

    申请日:2022-03-07

    Abstract: A sensing device, including a plurality of sensing pixels arranged in Y rows and M columns, a plurality of readout lines coupled to the sensing pixels, and a plurality of control lines each coupled to a sensing pixel subset, is provided. The Y times N sensing pixels within the sensing pixel subset are arranged in adjacent N columns, where Y, M and N are integers and N is smaller than M. Each of the control lines is configured to control one row of the sensing pixel subset to output signals through corresponding readout lines.

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