公开(公告)号：US10115696B2

公开(公告)日：2018-10-30

申请号：US15239885

申请日：2016-08-18

Applicant: InnoLux Corporation

Inventor： Yan-Syun Wang ,  Chi-Che Tsai ,  Chien-Feng Li ,  Wei yun Chang ,  Wei-Hsien Chang ,  Po-Ching Lin

IPC: H01L23/00 ,  H01L21/762 ,  H01L21/02

Abstract: An electronic device is disclosed, which comprises: a first substrate; an adhesion layer disposed on the first substrate and comprising a condensation product of silane or derivatives thereof; an inorganic layer disposed on the adhesion layer; and an active unit disposed on the inorganic layer. In addition, the present disclosure also provides a method for manufacturing the aforementioned electronic device.

公开(公告)号：US20230238252A1

公开(公告)日：2023-07-27

申请号：US17751643

申请日：2022-05-23

Applicant: Innolux Corporation

Inventor： Cheng-Chi Wang ,  Chien-Feng Li ,  Kuang-Ming Fan

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/568 ,  H01L24/19 ,  H01L23/293

Abstract: A manufacturing method of a package structure of an electronic device is provided. The manufacturing method includes the following. First, a carrier plate is provided. The carrier plate includes a composite structure and has a first surface and a second surface opposite to each other. Next, an anti-warpage structure is formed on the first surface of the carrier plate. Then, a redistribution structure is formed on the second surface of the carrier plate. When the package structure manufactured with the manufacturing method of the package structure of the electronic device of the disclosure is applied to the electronic device, reliability and/or electrical properties of the electronic device are enhanced.

公开(公告)号：US12185461B2

公开(公告)日：2024-12-31

申请号：US18073592

申请日：2022-12-02

Applicant: InnoLux Corporation

Inventor： Cheng-Chi Wang ,  Chin-Ming Huang ,  Chien-Feng Li ,  Chia-Lin Yang

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

公开(公告)号：US20210255499A1

公开(公告)日：2021-08-19

申请号：US17151644

申请日：2021-01-18

Applicant: InnoLux Corporation

Inventor： Ming-Han Wu ,  Chien-Feng Li ,  Hsin-Hao Huang ,  Chu-Hong Lai

IPC: G02F1/1333 ,  G02F1/1368

Abstract: The present disclosure provides an electronic device including a first flexible substrate, a second flexible substrate, a liquid crystal layer and a supporting structure. The second flexible substrate includes a first region and a second region. The first region overlaps with the first flexible substrate, and the second region does not overleap with the first flexible substrate. The liquid crystal layer is disposed between the first flexible substrate and the second flexible substrate. The supporting structure is disposed on the second region and includes a supporting film.