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公开(公告)号:US20220199519A1
公开(公告)日:2022-06-23
申请号:US17129854
申请日:2020-12-21
Applicant: Intel Corporation
Inventor: Chia-Ching LIN , Sou-Chi CHANG , Kaan OGUZ , I-Cheng TUNG , Arnab SEN GUPTA , Ian A. YOUNG , Uygar E. AVCI , Matthew V. METZ , Ashish Verma PENUMATCHA , Anandi ROY
IPC: H01L23/522 , H01L49/02
Abstract: Metal insulator metal capacitors are described. In an example, a metal-insulator-metal (MIM) capacitor includes a first electrode plate, and a first capacitor dielectric on the first electrode plate. The first capacitor dielectric is or includes a perovskite high-k dielectric material. A second electrode plate is on the first capacitor dielectric and has a portion over and parallel with the first electrode plate, and a second capacitor dielectric is on the second electrode plate. A third electrode plate is on the second capacitor dielectric and has a portion over and parallel with the second electrode plate.
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公开(公告)号:US20230096347A1
公开(公告)日:2023-03-30
申请号:US17485202
申请日:2021-09-24
Applicant: Intel Corporation
Inventor: Kevin P. O'BRIEN , Tristan A. TRONIC , Anandi ROY , Ashish Verma PENUMATCHA , Carl H. NAYLOR , Kirby MAXEY , Sudarat LEE , Chelsey DOROW , Scott B. CLENDENNING , Uygar E. AVCI
IPC: H01L27/092 , H01L29/06 , H01L29/417 , H01L29/423 , H01L29/45 , H01L29/49 , H01L29/786 , H01L21/02 , H01L21/28 , H01L21/8238 , H01L29/66
Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment, a semiconductor device comprises a sheet that is a semiconductor. In an embodiment a length dimension of the sheet and a width dimension of the sheet are greater than a thickness dimension of the sheet. In an embodiment, a gate structure is around the sheet, and a first spacer is adjacent to a first end of the gate structure, and a second spacer adjacent to a second end of the gate structure. In an embodiment, a source contact is around the sheet and adjacent to the first spacer, and a drain contact is around the sheet and adjacent to the second spacer.
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