公开(公告)号：US20230209775A1

公开(公告)日：2023-06-29

申请号：US17561916

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Kathiravan Dhandapani ,  Greeshmaja Govind ,  Asif S. Khan ,  Bijendra Singh ,  Yagnesh V. Waghela

IPC: H05K7/20 ,  F28D15/04 ,  F28D15/06 ,  F28D15/02 ,  G06F1/20

CPC classification number: H05K7/20336 ,  F28D15/06 ,  F28D15/046 ,  F28D15/0208 ,  F28D15/0233 ,  G06F1/20 ,  H05K7/20381 ,  G06F2200/201

Abstract: Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.