公开(公告)号：US20180235075A1

公开(公告)日：2018-08-16

申请号：US15434919

申请日：2017-02-16

Applicant: Intel Corporation

Inventor： Taylor Gaines ,  Anna M. Prakash ,  Ziv Belman ,  Baruch Schiffmann ,  Arnon Hirshberg ,  Ron Wittenberg ,  Vladimir Malamud

IPC: H05K1/02 ,  H05K3/22 ,  H05K1/18

CPC classification number: H01L23/552 ,  H05K1/0218 ,  H05K1/0243 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/2018 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.