公开(公告)号：US20240363520A1

公开(公告)日：2024-10-31

申请号：US18139083

申请日：2023-04-25

Applicant: Intel Corporation

Inventor： Ziyin LIN ,  Boer LIU ,  Dingying David XU ,  Karumbu MEYYAPPAN

IPC: H01L23/498 ,  H01R12/52

CPC classification number: H01L23/49894 ,  H01L23/49811 ,  H01L23/49833 ,  H01R12/52 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R4/2406 ,  H01R12/58 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10378

Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate with a layer on the substrate. In an embodiment, the layer comprises a plurality of wells. In an embodiment, a liquid metal is in the plurality of wells. In an embodiment, a cap is on the layer to seal the plurality of wells, where the cap comprises a polymer, and fibers within the polymer.