公开(公告)号：US20040188836A1

公开(公告)日：2004-09-30

申请号：US10402101

申请日：2003-03-28

Applicant: Intel Corporation

Inventor： Chung C. Key ,  Leong Kum Foo ,  Pang Toh Tien

IPC: H01L023/48

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10126 ,  H01L2224/10156 ,  H01L2224/81385 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K3/3436 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/0369 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a raised ring. The raised ring circumscribes the pad or surrounds an interior pad or land on the substrate.

Abstract translation: 球栅阵列器件包括衬底，还包括第一主表面和第二主表面。 衬垫阵列位于第一主表面或第二主表面之一上。 至少一些垫包括凸起的环。 凸环围绕衬垫或围绕衬垫或衬底上的衬垫。