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公开(公告)号:US20190007310A1
公开(公告)日:2019-01-03
申请号:US15639393
申请日:2017-06-30
Applicant: INTEL CORPORATION
Inventor: DEBENDRA DAS SHARMA , MICHELLE C. JEN , MARK S. MYERS , DON SOLTIS , RAMACHARAN SUNDARARAMAN , STEPHEN R. VAN DOREN , MAHESH WAGH
IPC: H04L12/781 , H04L29/06 , H04L12/931
Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.
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2.
公开(公告)号:US20170115716A1
公开(公告)日:2017-04-27
申请号:US15238717
申请日:2016-08-16
Applicant: Intel Corporation
Inventor: ANKUSH VARMA , KRISHNAKANTH V. SISTLA , MARTIN T. ROWLAND , CHRIS POIRIER , ERIC J. DEHAEMER , AVINASH N. ANANTHAKRISHNAN , JEREMY J. SHRALL , XIUTING C. MAN , STEPHEN H. GUNTHER , KRISHNA K. RANGAN , DEVADATTA V. BODAS , DON SOLTIS , HANG T. NGUYEN , CYPRIAN W. WOO , THI DANG
CPC classification number: G06F1/3243 , G06F1/206 , G06F1/28 , G06F1/3206 , Y02D10/152
Abstract: One embodiment of an apparatus includes a semiconductor chip having a processor and an on-die non-volatile storage resource. The on-die non-volatile storage may store different, appropriate performance related information for different configurations and usage cases of the processor for a same performance state of the processor.
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