公开(公告)号：US20190035721A1

公开(公告)日：2019-01-31

申请号：US16152213

申请日：2018-10-04

Applicant: Intel Corporation

Inventor： Eng Fook CHAN ,  Wei Chung LEE ,  Zhi Wei LOW

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16235 ,  H01L2224/8112 ,  H01L2224/81815 ,  H01L2924/1434 ,  H01L2924/1461 ,  H05K1/0213 ,  H05K1/114 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/10674

Abstract: A radial solder ball pattern is described for a printed circuit board and for a chip to be attached to the printed circuit board is described. In one example, the pattern comprises a central power connector area having a plurality of power connectors to provide power to an attached chip, a signal area having a plurality of signal connectors to communicate signals to the attached chip, an edge area surrounding the signal area and the central power connector area, and a plurality of traces each coupled to a signal connector, the traces extending from the respective coupled signal connector away from the central power connector to connect to an external component, wherein the signal connectors are placed in rows, the rows having a greater separation near the edge area than near the central area.