公开(公告)号：US20200066621A1

公开(公告)日：2020-02-27

申请号：US15752240

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Bin LIU ,  John G. MEYERS ,  Florence R. PON

IPC: H01L23/498 ,  H01L23/13 ,  H01L23/538 ,  H01L25/10 ,  H01L25/065 ,  H01L25/00

Abstract: A packaged device (110) includes a substrate (114) and one or more contacts (118) disposed on a side of the substrate (114). Structures of the packaged device (110) define at least in part a recess region (120) that extends from the side of the substrate (114) and through the substrate (114), where one or more contacts (124) of a second hardware interface are disposed in the recess region (120). The one or more contacts (118) of the first hardware interface enable connection of the packaged device (110) to a printed circuit board. The one or more contacts (124) of the second hardware interface enable connection between one or more IC dies of the packaged device (110) and another IC die (150) that is a component of the packaged device (110) or of a different packaged device.

公开(公告)号：US20210298183A1

公开(公告)日：2021-09-23

申请号：US17338450

申请日：2021-06-03

Applicant: Intel Corporation

Inventor： Florence R. PON ,  Bilal KHALAF ,  Saeed S. SHOJAIE

IPC: H05K3/28 ,  G01R31/28

Abstract: Embodiments are generally directed to a buried electrical debug access port. An embodiment of an apparatus includes a substrate or printed circuit board; one or more electronic components coupled with the substrate or printed circuit board; one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material; and an encapsulant material, the encapsulant material encapsulating the one or more access ports, wherein the one or more access ports are electrically connected to one or more circuits of the apparatus to provide debugging access to the apparatus.

公开(公告)号：US20170285097A1

公开(公告)日：2017-10-05

申请号：US15089385

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Florence R. PON ,  Bilal KHALAF ,  Saeed S. SHOJAIE

IPC: G01R31/28

CPC classification number: H05K3/284 ,  G01R31/2818 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Embodiments are generally directed to a buried electrical debug access port. An embodiment of an apparatus includes a substrate or printed circuit board; one or more electronic components coupled with the substrate or printed circuit board; one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material; and an encapsulant material, the encapsulant material encapsulating the one or more access ports, wherein the one or more access ports are electrically connected to one or more circuits of the apparatus to provide debugging access to the apparatus.