公开(公告)号：US20240186206A1

公开(公告)日：2024-06-06

申请号：US18438450

申请日：2024-02-10

申请人： Intel Corporation

发明人： Satish PRATHABAN ,  Ramaswamy PARTHASARATHY ,  Biswajit PATRA ,  Tongyan ZHAI ,  Jeff KU ,  Min Suet LIM ,  Yi HUANG ,  Kai XIAO ,  Gene F. YOUNG ,  Weimin SHI

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02

CPC分类号： H01L23/367 ,  H01L23/427 ,  H01L25/0655 ,  H01L25/18 ,  H05K1/0203 ,  H05K1/0262 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/1427 ,  H01L2924/15311

摘要： Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.

公开(公告)号：US20210044043A1

公开(公告)日：2021-02-11

申请号：US16537309

申请日：2019-08-09

申请人： Intel Corporation

发明人： Gene F. YOUNG

IPC分类号： H01R12/73 ,  H05K7/14 ,  H01R13/73 ,  H01R12/70

摘要： An apparatus is described. The apparatus includes a first riser card connected to a first card. The apparatus also includes a second riser card connected to a second card, wherein, the first card's connection to the first riser card and the second card's connection to the second riser card pass through a vertical plane runs parallel to respective surfaces of the first and second riser cards.