公开(公告)号：US11476174B2

公开(公告)日：2022-10-18

申请号：US16177046

申请日：2018-10-31

Applicant: Intel Corporation

Inventor： James Zhang ,  Yi Xu ,  Yuhong Cai

IPC: H01L23/02 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L23/538 ,  H01L25/065

Abstract: Embodiments described herein provide techniques for forming a solder mask having a repeating pattern of features formed therein. The repeating pattern of features can be conceptually understood as a plurality of groove structures formed in the solder mask. The solder mask can be included in a semiconductor package that comprises the solder mask over a substrate and a molding compound over the solder mask that conforms to the repeating pattern of features. Several advantages are attributable to embodiments of the solder mask described herein. One advantage is that the repeating pattern of features formed in the solder mask increase the contact area between the solder mask and the molding compound. Increasing the contact area can assist with increasing adherence and conformance of the molding compound to the solder mask. This increased adherence and conformance assists with minimizing or eliminating interfacial delamination.

公开(公告)号：US11948917B2

公开(公告)日：2024-04-02

申请号：US16392295

申请日：2019-04-23

Applicant: Intel Corporation

Inventor： Florence Pon ,  Yi Xu ,  James Zhang ,  Yuhong Cai ,  Tyler Leuten ,  William Glennan ,  Hyoung Il Kim

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L25/50 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06586

Abstract: Embodiments described herein provide a semiconductor package comprising multiple dies encapsulated in multiple molding compounds. In one example, a semiconductor package comprises: a first die or die stack on a substrate; a first molding compound encapsulating the first die or die stack on the substrate; a second die or die stack on the first molding compound; and a second molding compound encapsulating the second die or die stack and at least one portion of the first molding compound. In this example, the first die or die stack is electrically coupled to the substrate using a first wire bond and the second die or die stack is electrically coupled to the substrate using a second wire bond. Additionally, the first molding compound encapsulates the first wire bond and the second molding compound encapsulates the second wire bond. Furthermore, a footprint of the second die overlaps a footprint of the first die.