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公开(公告)号:US20190113545A1
公开(公告)日:2019-04-18
申请号:US16096968
申请日:2016-07-01
Applicant: Intel Corporation
Inventor: Georgios C. DOGIAMIS , Adel A. ELSHERBINI , Shawna M. LIFF , Johanna M. SWAN , Jelena CULIC-VISKOTA , Thomas L. SOUNART , Feras EID , Sasha N. OSTER
Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.
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公开(公告)号:US20180323130A1
公开(公告)日:2018-11-08
申请号:US15771025
申请日:2015-12-22
Applicant: Intel Corporation
Inventor: Boxi LIU , Syadwad JAIN , Jelena CULIC-VISKOTA , Nachiket R. RARAVIKAR , James C. MATAYABAS, Jr.
IPC: H01L23/373 , C08K3/08 , C08L83/04 , C08G77/12 , H01L23/367 , C09K5/06 , H01L23/00
CPC classification number: H01L23/3737 , C08G77/12 , C08G77/20 , C08K3/08 , C08K5/00 , C08K5/56 , C08L83/00 , C08L83/04 , C09K5/063 , H01L23/34 , H01L23/3672 , H01L24/83 , H01L2224/8384 , H01L2224/83862
Abstract: An adhesive polymer thermal interface material is described with sintered fillers for thermal conductivity in micro-electronic packaging. Embodiments include a polymer thermal interface material (PTIM) with sinterable thermally conductive filler particles, a dispersant, and a silicone polymer matrix.
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