公开(公告)号：US20190113545A1

公开(公告)日：2019-04-18

申请号：US16096968

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Jelena CULIC-VISKOTA ,  Thomas L. SOUNART ,  Feras EID ,  Sasha N. OSTER

IPC: G01R15/20 ,  H01L41/06 ,  H01L41/12

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

公开(公告)号：US20180323130A1

公开(公告)日：2018-11-08

申请号：US15771025

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Boxi LIU ,  Syadwad JAIN ,  Jelena CULIC-VISKOTA ,  Nachiket R. RARAVIKAR ,  James C. MATAYABAS, Jr.

IPC: H01L23/373 ,  C08K3/08 ,  C08L83/04 ,  C08G77/12 ,  H01L23/367 ,  C09K5/06 ,  H01L23/00

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/08 ,  C08K5/00 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C09K5/063 ,  H01L23/34 ,  H01L23/3672 ,  H01L24/83 ,  H01L2224/8384 ,  H01L2224/83862

Abstract: An adhesive polymer thermal interface material is described with sintered fillers for thermal conductivity in micro-electronic packaging. Embodiments include a polymer thermal interface material (PTIM) with sinterable thermally conductive filler particles, a dispersant, and a silicone polymer matrix.