公开(公告)号：US20240413089A1

公开(公告)日：2024-12-12

申请号：US18806287

申请日：2024-08-15

Applicant: Intel Corporation

Inventor： Mathew J. MANUSHAROW ,  Jonathan ROSENFELD

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/64 ,  H01L25/00 ,  H01L25/065

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

公开(公告)号：US20230343714A1

公开(公告)日：2023-10-26

申请号：US18216989

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Mathew J. MANUSHAROW ,  Jonathan ROSENFELD

IPC: H01L23/538 ,  H01L23/64 ,  H01L23/498 ,  H01L25/00 ,  H01L21/48 ,  H01L25/065

CPC classification number: H01L23/5383 ,  H01L23/642 ,  H01L23/49822 ,  H01L25/50 ,  H01L23/647 ,  H01L21/4857 ,  H01L25/065 ,  H01L25/0655 ,  H01L23/49816 ,  H01L23/5385 ,  H01L2224/16235 ,  H01L24/16

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

公开(公告)号：US20230307373A1

公开(公告)日：2023-09-28

申请号：US18202136

申请日：2023-05-25

Applicant: Intel Corporation

Inventor： Mathew J. MANUSHAROW ,  Jonathan ROSENFELD

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498 ,  H01L23/64 ,  H01L25/00

CPC classification number: H01L23/5383 ,  H01L25/065 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L25/0655 ,  H01L25/50 ,  H01L2924/15192 ,  H01L2224/16235 ,  H01L2224/16227 ,  H01L23/5385 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L24/16

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

公开(公告)号：US20220115326A1

公开(公告)日：2022-04-14

申请号：US17555213

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Mathew J. MANUSHAROW ,  Jonathan ROSENFELD

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498 ,  H01L23/64 ,  H01L25/00

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.