公开(公告)号：US20210398909A1

公开(公告)日：2021-12-23

申请号：US16905202

申请日：2020-06-18

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Feras Eid ,  Adel Elsherbini ,  David Johnston ,  Jyothi Bhaskarr Velamala ,  Rachael Parker

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/498 ,  H04L9/32

Abstract: Techniques and mechanisms for providing physically unclonable function (PUF) circuitry at a substrate which supports coupling to an integrated circuit (IC) chip. In an embodiment, the substrate comprises an array of electrodes which extend in a level of metallization at a side of the insulator layer. A cap layer, disposed on the array, is in contact with the electrodes and with a portion of the insulator layer which is between the electrodes. A material of the cap layer has a different composition or microstructure than the metallization. Regions of the cap layer variously provide respective impedances each between a corresponding two electrodes. In other embodiments, the substrate includes (or couples to) integrated circuitry that is operable to determine security information based on the detection of one or more such impedances.

公开(公告)号：US20230162772A1

公开(公告)日：2023-05-25

申请号：US17706124

申请日：2022-03-28

Applicant: Intel Corporation

Inventor： Yu-Lin Chao ,  Zhanping Chen ,  Sarvesh Kulkarni ,  Rachael Parker ,  Jyothi Bhaskarr Velamala

IPC: G11C7/24 ,  G11C17/16 ,  G11C17/18

CPC classification number: G11C7/24 ,  G11C17/16 ,  G11C17/18

Abstract: Hot carrier injection (HCI) may be used to provide various improvements for one-time programmable (OTP) read-only memory (ROM) or physical unclonable function (PUF) circuits. HCI may be used to write a memory bit (e.g., logical 0 or 1), which may be used in OTP ROM. HCI may be used to provide improved programmable ROM (PROM) memory devices, such as to facilitate programming or to increase sensing window. HCI may also be used to write a memory bit in a PUF circuit. HCI may provide a cross-foundry portable PUF circuit that has an associated adjustable bit error rate (BER), which may be used to secure root key generation, or may be used to provide a unique identification (ID) for fuse replacement.

公开(公告)号：US11990419B2

公开(公告)日：2024-05-21

申请号：US16905202

申请日：2020-06-18

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Feras Eid ,  Adel Elsherbini ,  David Johnston ,  Jyothi Bhaskarr Velamala ,  Rachael Parker

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/498 ,  H04L9/32

CPC classification number: H01L23/544 ,  H01L23/49838 ,  H01L24/73 ,  H04L9/3278 ,  H01L2223/54413 ,  H01L2224/73204

Abstract: Techniques and mechanisms for providing physically unclonable function (PUF) circuitry at a substrate which supports coupling to an integrated circuit (IC) chip. In an embodiment, the substrate comprises an array of electrodes which extend in a level of metallization at a side of the insulator layer. A cap layer, disposed on the array, is in contact with the electrodes and with a portion of the insulator layer which is between the electrodes. A material of the cap layer has a different composition or microstructure than the metallization. Regions of the cap layer variously provide respective impedances each between a corresponding two electrodes. In other embodiments, the substrate includes (or couples to) integrated circuitry that is operable to determine security information based on the detection of one or more such impedances.