公开(公告)号：US11804470B2

公开(公告)日：2023-10-31

申请号：US16548255

申请日：2019-08-22

申请人： Intel Corporation

发明人： Xavier F. Brun ,  Kaizad Mistry ,  Paul R. Start ,  Nisha Ananthakrishnan ,  Yawei Liang ,  Jigneshkumar P. Patel ,  Sairam Agraharam ,  Liwei Wang

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/367 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  H01L23/48 ,  H01L21/56

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L23/291 ,  H01L23/3135 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/18 ,  H01L25/50 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2224/29186 ,  H01L2224/32145 ,  H01L2224/73253

摘要： Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a plurality of first dies on a substrate, an encapsulation layer over the first dies and the substrate, an interface layer over the first dies and the encapsulation layer, and a passive heat spreader on the interface layer, wherein the interface layer thermally couples the first dies to the passive heat spreader. The passive heat spreader includes a silicon (Si) or a silicon carbide (SiC). The interface layer includes a silicon nitride (SiN) material, a silicon monoxide (SiO) material, a silicon carbon nitride (SiCN) material, or a thermal adhesive material. The semiconductor package may include a plurality of second dies and the substrate on a package substrate, a thermal interface material (TIM) over the second dies, the passive heat spreader, and the package substrate, and a heat spreader over the TIM and the package substrate.