公开(公告)号：US20150209780A1

公开(公告)日：2015-07-30

申请号：US14683826

申请日：2015-04-10

Applicant: Intel Corporation

Inventor： Lakshmi Supriya ,  James C. Matayabas, JR. ,  Nirupama Chakrapani

IPC: B01L3/00 ,  B05D5/00 ,  B05D3/12

CPC classification number: B01L3/502707 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00619 ,  B01L3/502715 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/046 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2300/0867 ,  B01L2300/089 ,  B01L2300/16 ,  B01L2300/161 ,  B01L2300/165 ,  B01L2400/0406 ,  B01L2400/0688 ,  B05D3/12 ,  B05D5/00

Abstract: A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Abstract translation: 微电子封装包括可以包括用于分析流体的MEMS和CMOS电路的管芯。 提供了将流体引导到管芯的限定的路径。 定义的路径不是在封装衬底中图案化凹陷或物理通道，而是包括可以将液体流引导到用于生物传感器类型应用的管芯的涂层。 所定义的路径可以包括对流体具有亲和性的润湿涂层。 相似地，所定义的路径可以包括去湿涂层，其倾向于排斥路径周围的流体。

公开(公告)号：US09604210B2

公开(公告)日：2017-03-28

申请号：US14683826

申请日：2015-04-10

Applicant: Intel Corporation

Inventor： Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

IPC: B01L3/00 ,  B05D3/12 ,  B05D5/00 ,  B29C65/00 ,  B01J19/00

CPC classification number: B01L3/502707 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00619 ,  B01L3/502715 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/046 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2300/0867 ,  B01L2300/089 ,  B01L2300/16 ,  B01L2300/161 ,  B01L2300/165 ,  B01L2400/0406 ,  B01L2400/0688 ,  B05D3/12 ,  B05D5/00

Abstract: A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.