公开(公告)号：US11705389B2

公开(公告)日：2023-07-18

申请号：US16437420

申请日：2019-06-11

Applicant: Intel Corporation

Inventor： Andrew J. Brown ,  Luke Garner ,  Liwei Cheng ,  Lauren Link ,  Cheng Xu ,  Ying Wang ,  Bin Zou ,  Chong Zhang

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49894

Abstract: Embodiments herein describe techniques for a semiconductor device including a package substrate. The package substrate includes a via pad at least partially in a core layer. A first dielectric layer having a first dielectric material is above the via pad and the core layer, where the first dielectric layer has a first through hole that is through the first dielectric layer to reach the via pad. A second dielectric layer having a second dielectric material is at least partially filling the first through hole, where the second dielectric layer has a second through hole that is through the second dielectric layer to reach the via pad. A via is further within the second through hole of the second dielectric layer, surrounded by the second dielectric material, and in contact with the via pad. Other embodiments may be described and/or claimed.

公开(公告)号：US11651902B2

公开(公告)日：2023-05-16

申请号：US16024715

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Rahul Jain ,  Andrew J. Brown ,  Prithwish Chatterjee ,  Sai Vadlamani ,  Lauren Link

IPC: H01L23/522 ,  H01G4/33 ,  H01L49/02

CPC classification number: H01G4/33 ,  H01L23/5222 ,  H01L28/40

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.