公开(公告)号：US20190067156A1

公开(公告)日：2019-02-28

申请号：US15688662

申请日：2017-08-28

Applicant: Intel Corporation

Inventor： Hyoung Il Kim ,  Florence Pon ,  Yi Xu ,  Yuhong Cai ,  Min-Tih Lai ,  Leo Craft

IPC: H01L23/367 ,  H01L23/34 ,  H01L23/055 ,  H01L23/14 ,  H01L25/065

Abstract: Embodiments of the present disclosure provide techniques and configurations for a semiconductor package with thermal fins, in accordance with some embodiments. In embodiments, a package assembly may comprise a die and a mold compound disposed on the die, to encapsulate the die. The package may further include a thermal solution comprising one or more thermal fins attached to the mold compound at their respective ends. The thermal fins may be disposed substantially flat on a top surface of the mold compound at a first temperature, and rise away from the top surface of the mold compound in response to a change of temperature to a second temperature, to reach an enclosure that surrounds the package assembly, to provide direct heat conductivity between the die and the enclosure. The second temperature may be greater than the first temperature. Other embodiments may be described and/or claimed.

公开(公告)号：US10573575B2

公开(公告)日：2020-02-25

申请号：US15688662

申请日：2017-08-28

Applicant: Intel Corporation

Inventor： Hyoung Il Kim ,  Florence Pon ,  Yi Xu ,  Yuhong Cai ,  Min-Tih Lai ,  Leo Craft

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/055 ,  H01L23/14 ,  H01L25/065

Abstract: Embodiments of the present disclosure provide techniques and configurations for a semiconductor package with thermal fins, in accordance with some embodiments. In embodiments, a package assembly includes a die and a mold compound disposed on the die, to encapsulate the die. The package may further include a thermal solution including one or more thermal fins attached to the mold compound at their respective ends. The thermal fins may be disposed substantially flat on a top surface of the mold compound at a first temperature, and rise away from the top surface of the mold compound in response to a change of temperature to a second temperature, to reach an enclosure that surrounds the package assembly, to provide direct heat conductivity between the die and the enclosure. The second temperature may be greater than the first temperature. Other embodiments may be described and/or claimed.