公开(公告)号：US20180005965A1

公开(公告)日：2018-01-04

申请号：US15201375

申请日：2016-07-01

申请人： Intel Corporation

发明人： Yu Amos ZHANG ,  Jihwan KIM ,  Ajay BALANKUTTY ,  Anupriya SRIRAMULU ,  MD. Mohiuddin MAZUMDER ,  Frank O'MAHONY ,  Zuoguo WU ,  Kemal AYGUN

IPC分类号： H01L23/64 ,  H01L23/66 ,  H01L27/02 ,  H02H9/04

CPC分类号： H01L23/645 ,  H01L23/66 ,  H01L27/0248 ,  H01L27/0288 ,  H02H9/046

摘要： Integrated circuit (IC) chip “on-die” inductor structures (systems and methods for their manufacture) may improve signaling from a data signal circuit to a surface contact of the chip. Such inductor structures may include a first data signal inductor having (1) a second end electrically coupled to an electrostatic discharge (ESD) circuit and a capacitance value of that circuit, and (2) a first end electrically coupled to a the data signal surface contact and to a capacitance value at that contact; and a second data signal inductor having (1) a second end electrically coupled to the data signal circuit and a capacitance value of that circuit, (2) a first end electrically coupled to the second end of the first data signal inductor, and to the capacitance value of the ESD circuit. Inductor values of the first and second inductors may be selected to cancel out the capacitance values to improve signaling.