公开(公告)号：US20190295953A1

公开(公告)日：2019-09-26

申请号：US15933934

申请日：2018-03-23

申请人： Intel Corporation

发明人： Mayue XIE ,  Jong-Ru GUO ,  Zhiguo QIAN ,  Zuoguo WU

IPC分类号： H01L23/538 ,  H01L23/58 ,  H01L25/065

摘要： Apparatuses, systems and methods associated with integrated circuit packages with integrated test circuitry for testing of a channel between dies are disclosed herein. In embodiments, an integrated circuit (IC) package may include a first die, a second die, and a channel that couples the first die to the second die. The first die may include a transmitter, test circuitry coupled between the transmitter and the channel, wherein the test circuitry is to control charge and discharge of the channel, and a receiver coupled to the channel. The receiver may determine a voltage of the channel during charge and discharge of the channel, and output an indication of the voltage. Other embodiments may be described and/or claimed.

公开(公告)号：US20180005965A1

公开(公告)日：2018-01-04

申请号：US15201375

申请日：2016-07-01

申请人： Intel Corporation

发明人： Yu Amos ZHANG ,  Jihwan KIM ,  Ajay BALANKUTTY ,  Anupriya SRIRAMULU ,  MD. Mohiuddin MAZUMDER ,  Frank O'MAHONY ,  Zuoguo WU ,  Kemal AYGUN

IPC分类号： H01L23/64 ,  H01L23/66 ,  H01L27/02 ,  H02H9/04

CPC分类号： H01L23/645 ,  H01L23/66 ,  H01L27/0248 ,  H01L27/0288 ,  H02H9/046

摘要： Integrated circuit (IC) chip “on-die” inductor structures (systems and methods for their manufacture) may improve signaling from a data signal circuit to a surface contact of the chip. Such inductor structures may include a first data signal inductor having (1) a second end electrically coupled to an electrostatic discharge (ESD) circuit and a capacitance value of that circuit, and (2) a first end electrically coupled to a the data signal surface contact and to a capacitance value at that contact; and a second data signal inductor having (1) a second end electrically coupled to the data signal circuit and a capacitance value of that circuit, (2) a first end electrically coupled to the second end of the first data signal inductor, and to the capacitance value of the ESD circuit. Inductor values of the first and second inductors may be selected to cancel out the capacitance values to improve signaling.

公开(公告)号：US20220206064A1

公开(公告)日：2022-06-30

申请号：US17133659

申请日：2020-12-24

申请人： Intel Corporation

发明人： Zhen ZHOU ,  Renzhi LIU ,  Jong-Ru GUO ,  Kenneth P. FOUST ,  Jason A. MIX ,  Kai XIAO ,  Zuoguo WU ,  Daqiao DU

IPC分类号： G01R31/302 ,  H01P3/08 ,  H01Q9/16 ,  H04B5/02 ,  G01R31/28 ,  G01R31/303

摘要： A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.

公开(公告)号：US20190045622A1

公开(公告)日：2019-02-07

申请号：US15817098

申请日：2017-11-17

申请人： Intel Corporation

发明人： Jun LIAO ,  Zhen ZHOU ,  James A. McCALL ,  Jong-Ru GUO ,  Xiang LI ,  Yunhui CHU ,  Zuoguo WU

IPC分类号： H05K1/02 ,  H05K1/14

摘要： An apparatus is described. The apparatus includes a semiconductor chip having cross-talk noise cancellation circuitry disposed between a disturber trace and a trace to be protected from cross-talk noise emanating from the disturber trace. The trace is to be coupled to a receiver disposed on a different semiconductor chip.

公开(公告)号：US20170163286A1

公开(公告)日：2017-06-08

申请号：US15039544

申请日：2013-12-26

申请人： Intel Corporation

发明人： Zuoguo WU ,  Debendra DAS SHARMA ,  Md. Mohiuddin MAZUMDER ,  Subas BASTOLA ,  Kai XIAO

IPC分类号： H03M13/11 ,  G06F13/42 ,  G06F13/40 ,  G06F13/36

CPC分类号： H03M13/11 ,  G06F13/36 ,  G06F13/385 ,  G06F13/4068 ,  G06F13/4282 ,  G06F2213/0026

摘要： An identification is made that a link is to exit an active state, the link comprising a plurality of lanes. Parity information is maintained for the lanes based on data previously sent over the link, and an indication of the parity information is sent prior to the exit from the active state.