公开(公告)号：US20250093413A1

公开(公告)日：2025-03-20

申请号：US18963838

申请日：2024-11-29

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Renzhi LIU ,  Jong-Ru GUO ,  Kenneth P. FOUST ,  Jason A. MIX ,  Kai XIAO ,  Zuoguo WU ,  Daqiao DU

IPC: G01R31/302 ,  G01R31/28 ,  G01R31/303 ,  H01P3/08 ,  H01Q9/16 ,  H04B5/48

Abstract: A high volume manufacturing (HVM) test system including a test device defining an opening configured to receive a package under test, the test device including an external access agent (EAA) including: a first leaky surface wave launcher for near field wireless communication, the first leaky surface wave launcher configured to wirelessly provide sideband signals to and wirelessly receive the sideband signals from a silicon package agent physically positioned in a separate package as the EAA; and a first transceiver electrically coupled to the first leaky surface wave launcher, the first transceiver configured to: process the sideband signals received by the first leaky surface wave launcher; and generate the sideband signals for wireless transmission by the first leaky surface wave launcher.

公开(公告)号：US20190295953A1

公开(公告)日：2019-09-26

申请号：US15933934

申请日：2018-03-23

Applicant: Intel Corporation

Inventor： Mayue XIE ,  Jong-Ru GUO ,  Zhiguo QIAN ,  Zuoguo WU

IPC: H01L23/538 ,  H01L23/58 ,  H01L25/065

Abstract: Apparatuses, systems and methods associated with integrated circuit packages with integrated test circuitry for testing of a channel between dies are disclosed herein. In embodiments, an integrated circuit (IC) package may include a first die, a second die, and a channel that couples the first die to the second die. The first die may include a transmitter, test circuitry coupled between the transmitter and the channel, wherein the test circuitry is to control charge and discharge of the channel, and a receiver coupled to the channel. The receiver may determine a voltage of the channel during charge and discharge of the channel, and output an indication of the voltage. Other embodiments may be described and/or claimed.

公开(公告)号：US20180005965A1

公开(公告)日：2018-01-04

申请号：US15201375

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Yu Amos ZHANG ,  Jihwan KIM ,  Ajay BALANKUTTY ,  Anupriya SRIRAMULU ,  MD. Mohiuddin MAZUMDER ,  Frank O'MAHONY ,  Zuoguo WU ,  Kemal AYGUN

IPC: H01L23/64 ,  H01L23/66 ,  H01L27/02 ,  H02H9/04

CPC classification number: H01L23/645 ,  H01L23/66 ,  H01L27/0248 ,  H01L27/0288 ,  H02H9/046

Abstract: Integrated circuit (IC) chip “on-die” inductor structures (systems and methods for their manufacture) may improve signaling from a data signal circuit to a surface contact of the chip. Such inductor structures may include a first data signal inductor having (1) a second end electrically coupled to an electrostatic discharge (ESD) circuit and a capacitance value of that circuit, and (2) a first end electrically coupled to a the data signal surface contact and to a capacitance value at that contact; and a second data signal inductor having (1) a second end electrically coupled to the data signal circuit and a capacitance value of that circuit, (2) a first end electrically coupled to the second end of the first data signal inductor, and to the capacitance value of the ESD circuit. Inductor values of the first and second inductors may be selected to cancel out the capacitance values to improve signaling.

公开(公告)号：US20220206064A1

公开(公告)日：2022-06-30

申请号：US17133659

申请日：2020-12-24

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Renzhi LIU ,  Jong-Ru GUO ,  Kenneth P. FOUST ,  Jason A. MIX ,  Kai XIAO ,  Zuoguo WU ,  Daqiao DU

IPC: G01R31/302 ,  H01P3/08 ,  H01Q9/16 ,  H04B5/02 ,  G01R31/28 ,  G01R31/303

Abstract: A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.

公开(公告)号：US20190045622A1

公开(公告)日：2019-02-07

申请号：US15817098

申请日：2017-11-17

Applicant: Intel Corporation

Inventor： Jun LIAO ,  Zhen ZHOU ,  James A. McCALL ,  Jong-Ru GUO ,  Xiang LI ,  Yunhui CHU ,  Zuoguo WU

IPC: H05K1/02 ,  H05K1/14

Abstract: An apparatus is described. The apparatus includes a semiconductor chip having cross-talk noise cancellation circuitry disposed between a disturber trace and a trace to be protected from cross-talk noise emanating from the disturber trace. The trace is to be coupled to a receiver disposed on a different semiconductor chip.

公开(公告)号：US20170163286A1

公开(公告)日：2017-06-08

申请号：US15039544

申请日：2013-12-26

Applicant: Intel Corporation

Inventor： Zuoguo WU ,  Debendra DAS SHARMA ,  Md. Mohiuddin MAZUMDER ,  Subas BASTOLA ,  Kai XIAO

IPC: H03M13/11 ,  G06F13/42 ,  G06F13/40 ,  G06F13/36

CPC classification number: H03M13/11 ,  G06F13/36 ,  G06F13/385 ,  G06F13/4068 ,  G06F13/4282 ,  G06F2213/0026

Abstract: An identification is made that a link is to exit an active state, the link comprising a plurality of lanes. Parity information is maintained for the lanes based on data previously sent over the link, and an indication of the parity information is sent prior to the exit from the active state.