公开(公告)号：US10429439B2

公开(公告)日：2019-10-01

申请号：US15201315

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Dae-Woo Kim ,  J. Daniel Bryan ,  Joseph W. Parks, Jr. ,  Ethan Caughey ,  Mark W. Dryfuse

IPC: G01R31/28 ,  G01R31/26 ,  H01L23/538 ,  G01R1/073

Abstract: An apparatus for testing a die can comprise a first printed circuit board (PCB), a space transformer, and a plurality of probes. The first PCB can be configured to connect to a second PCB. The space transformer can be attached to the PCB. The space transformer can include a plurality of traces. Each of the plurality of probes can be connected to one of the plurality of traces.