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公开(公告)号:US20240355758A1
公开(公告)日:2024-10-24
申请号:US18756926
申请日:2024-06-27
Applicant: Intel Corporation
Inventor: Steven Adam Klein , Jason Gamba , Matthew Thomas Guzy , Nicholas Steven Haehn , Tarek Adly Ibrahim , Brandon Christian Marin , Srinivas Venkata Ramanuja Pietambaram , Jacob John Schichtel
IPC: H01L23/544 , H01L23/15 , H01L23/40
CPC classification number: H01L23/544 , H01L23/15 , H01L23/4006 , H01L2023/4087 , H01L2223/54426
Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. An example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. The substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. The first surface supports the semiconductor die. The second surface includes first contacts to electrical couple with second contacts in a socket. At least a portion of the third surface separated and distinct from the glass core.