公开(公告)号：US20250062207A1

公开(公告)日：2025-02-20

申请号：US18933879

申请日：2024-10-31

Applicant: Intel Corporation

Inventor： Srinivas Venkata Ramanuja Pietambaram ,  Tarek Adly Ibrahim ,  Ravindra Vijay Tanikella

IPC: H01L23/498 ,  H01L23/15

Abstract: Methods and apparatus to reduce cracking in glass cores are disclosed. An example apparatus includes a package substrate comprising a glass core having an opening extending between first and second surfaces of the glass core, the first surface opposite the second surface, and a conductive material, a first portion of the conductive material within the opening, a second portion of the conductive material protruding beyond the first surface of the glass core, a first surface of the first portion in continuity with a second surface of the second portion.

公开(公告)号：US20240355758A1

公开(公告)日：2024-10-24

申请号：US18756926

申请日：2024-06-27

Applicant: Intel Corporation

Inventor： Steven Adam Klein ,  Jason Gamba ,  Matthew Thomas Guzy ,  Nicholas Steven Haehn ,  Tarek Adly Ibrahim ,  Brandon Christian Marin ,  Srinivas Venkata Ramanuja Pietambaram ,  Jacob John Schichtel

IPC: H01L23/544 ,  H01L23/15 ,  H01L23/40

CPC classification number: H01L23/544 ,  H01L23/15 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/54426

Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. An example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. The substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. The first surface supports the semiconductor die. The second surface includes first contacts to electrical couple with second contacts in a socket. At least a portion of the third surface separated and distinct from the glass core.