公开(公告)号：US20240006358A1

公开(公告)日：2024-01-04

申请号：US17854813

申请日：2022-06-30

申请人： Intel Corporation

发明人： Zhihua Zou ,  Omkar Karhade ,  Botao Zhang ,  Julia Chiu ,  Vivek Chidambaram ,  Yi Shi ,  Mohit Bhatia ,  Mostafa Aghazadeh

IPC分类号： H01L23/00

CPC分类号： H01L24/08 ,  H01L24/80 ,  H01L2224/08059 ,  H01L2224/08145 ,  H01L2224/80031 ,  H01L2224/80895 ,  H01L2224/80896

摘要： Bonding pedestals on substrates, and their manufacture, for direct bonding integrated circuit (IC) dies onto substrates. The electrical interconnections of one or more IC dies and a substrate are bonded together with the IC dies on and overhanging the pedestals. A bonding pedestal may be formed by etching down the substrate around the interconnections. A system may include one or more such pedestals above and adjacent a recessed surface on a substrate with IC dies overhanging the pedestals. Such a system may be coupled to a host component, such as a board, and a power supply via the host component.

公开(公告)号：US11679407B2

公开(公告)日：2023-06-20

申请号：US16913986

申请日：2020-06-26

申请人： Intel Corporation

发明人： Kyle Jordan Arrington ,  Joseph Blaine Petrini ,  Aaron McCann ,  Shankar Devasenathipathy ,  James Christopher Matayabas, Jr. ,  Mostafa Aghazadeh ,  Jerrod Peterson

IPC分类号： B05C1/02 ,  B05C1/00 ,  C23C28/00 ,  H05K7/20 ,  B05D1/28

CPC分类号： B05C1/02 ,  B05C1/00 ,  C23C28/00 ,  B05D1/28 ,  H05K7/2039

摘要： To address technical problems facing silicon transient thermal management, a thermal interface material (TIM) may be used to provide improved thermal conduction. The TIM may include a liquid metal (LM) TIM, which may provide a significant reduction in thermal resistance, such as a thermal resistance RTIM≈0.01-0.025° C.-cm2/W. The LM TIM may be applied using a presoaked applicator, such as an open-cell polyurethane foam applicator that has been presoaked in a controlled amount of LM TIM. This LM presoaked applicator is then used to apply the LM TIM to one or more target thermal surfaces, thereby providing thermal and mechanical coupling between the LM TIM and the thermal surface. The resulting thermal surface and thermally conductive LM TIM may be used to improve thermal conduction for various silicon-based devices, including various high-power, high-performance system-on-chip (SoC) packages, such as may be used in portable consumer products.