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公开(公告)号:US10186465B2
公开(公告)日:2019-01-22
申请号:US15748138
申请日:2015-09-25
Applicant: Intel Corporation
Inventor: Feras Eid , Adel A. Elsherbini , Henning Braunisch , Yidnekachew S. Mekonnen , Krishna Bharath , Mathew J. Manusharow , Aleksandar Aleksov , Nathan Fritz
IPC: H01L23/14 , H01L23/12 , H01L23/473 , H01L21/48 , H01L23/538 , H01L23/492
Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.