公开(公告)号：US11804657B2

公开(公告)日：2023-10-31

申请号：US17448746

申请日：2021-09-24

申请人： Intel Corporation

发明人： Jayprakash Thakur ,  Maruti Tamrakar ,  Sagar Gupta ,  Harry G. Skinner ,  Prakash Kurma Raju

IPC分类号： H01Q13/10 ,  H05K1/02

CPC分类号： H01Q13/10 ,  H05K1/0237 ,  H05K1/0277

摘要： A chassis for an electronic device is provided. The chassis comprises a chassis part made of conducting material. At least one slot antenna is formed in the chassis part made of conducting material.

公开(公告)号：US20230198568A1

公开(公告)日：2023-06-22

申请号：US17559843

申请日：2021-12-22

申请人： Intel Corporation

发明人： Maruti Tamrakar ,  Jayprakash Thakur ,  Sagar Gupta ,  Rajasekar Arumanayagam ,  Amarjeet Kumar

IPC分类号： H04B1/44

CPC分类号： H04B1/44

摘要： Embodiments of the present disclosure are directed to antenna switching systems. For example, some embodiments may include a switching system to allow a computing system to switch between an internal antenna and an external antenna. Other embodiments may be described and claimed.

公开(公告)号：US12087995B2

公开(公告)日：2024-09-10

申请号：US17455928

申请日：2021-11-22

申请人： Intel Corporation

发明人： Jayprakash Thakur ,  Prasanna Pichumani ,  Maruti Tamrakar ,  Doddi Raghavendra ,  Sagar Gupta

IPC分类号： H01Q1/02 ,  H01Q1/12 ,  H01Q9/04

CPC分类号： H01Q1/02 ,  H01Q1/12 ,  H01Q9/04 ,  H01Q9/0407

摘要： Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.

公开(公告)号：US12046819B2

公开(公告)日：2024-07-23

申请号：US17448724

申请日：2021-09-24

申请人： Intel Corporation

发明人： Maruti Tamrakar ,  Sagar Gupta ,  Jayprakash Thakur ,  Prasanna Pichumani

IPC分类号： H01Q1/22 ,  H01Q1/38 ,  H01Q13/10 ,  H01Q21/06

CPC分类号： H01Q21/064 ,  H01Q1/38 ,  H01Q13/106

摘要： A slot antenna assembly for a portable electronic device is disclosed. The assembly includes a first slot antenna having a first slot through a substrate from an outer surface of the substrate to an inner surface of the substrate. The assembly also includes a second slot antenna including a second slot through the substrate from the outer surface of the substrate to the inner surface of the substrate. An isolator includes at least one of an isolation slot and a conductor. The isolation slot includes a substrate isolation slot which extends through the substrate between the first and second slot antennas; and a conductor. The conductor connects the inner surface of the substrate between the first and second antennas to an opposite inner surface of an opposite substrate opposite the inner surface between the first and second antennas.

公开(公告)号：US20230216453A1

公开(公告)日：2023-07-06

申请号：US18121315

申请日：2023-03-14

申请人： Intel Corporation

发明人： Yagnesh V. Waghela ,  Sumod Cherukkate ,  Sagar Gupta ,  Sudhakar Arehole Narayana Manja ,  Soumya Prakash Mishra ,  Bala Subramanya ,  Jayprakash Thakur

IPC分类号： H03F3/189 ,  H04R9/06

CPC分类号： H03F3/189 ,  H04R9/06 ,  H03F2200/451 ,  H03F2200/03

摘要： The speaker coil in a dynamic speaker in a mobile computing device can be used to generate radio frequency (RF) signals having a frequency of about 100 kHz or greater. A speaker amplifier drives the dynamic speaker to produce sound and RF circuitry drives the speaker amplifier to generate the RF signals having a frequency of about 100 kHz or greater. The speaker coil can comprise a tap at an appropriate point between the ends of the coil to cause the coil to operate at resonance over a desired RF frequency band. A low-pass filter can be positioned at the speaker amplifier output to protect the speaker amplifier from RF energy generated by the RF circuitry and a high-pass filter can be positioned at the output of the RF circuitry to protect the RF circuitry from audio energy generated by the speaker amplifier.

公开(公告)号：US20210111486A1

公开(公告)日：2021-04-15

申请号：US17129705

申请日：2020-12-21

申请人： Intel Corporation

发明人： Maruti Tamrakar ,  Sagar Gupta ,  Jayprakash Thakur ,  Rakhi Singh

IPC分类号： H01Q1/52 ,  H01Q1/22 ,  H03H7/38 ,  H01Q1/24

摘要： Various embodiments provide an antenna assembly and associated systems, devices, and methods. The antenna assembly may include two or more antennas, including a first antenna and a second antenna, coupled to a ground plane. The antenna assembly may further include an isolation network coupled to the ground plane between the first and second antennas. The isolation network may include a conductive structure between conductive antenna portions of the first and second antennas, and an isolation circuit coupled between the conductive structure and the ground plane. The isolation circuit may include a resistor, an inductor, and/or a capacitor (e.g., coupled in parallel with one another). Other embodiments may be described and claimed.

公开(公告)号：US20210111481A1

公开(公告)日：2021-04-15

申请号：US17129698

申请日：2020-12-21

申请人： Intel Corporation

发明人： Jayprakash Thakur ,  Maruti Tamrakar ,  Sagar Gupta ,  Prasanna Pichumani ,  Sudheera Sudhakar

IPC分类号： H01Q1/24 ,  H04B1/3827 ,  H04B1/401 ,  H04W52/36

摘要： Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.