公开(公告)号：US12087995B2

公开(公告)日：2024-09-10

申请号：US17455928

申请日：2021-11-22

申请人： Intel Corporation

发明人： Jayprakash Thakur ,  Prasanna Pichumani ,  Maruti Tamrakar ,  Doddi Raghavendra ,  Sagar Gupta

IPC分类号： H01Q1/02 ,  H01Q1/12 ,  H01Q9/04

CPC分类号： H01Q1/02 ,  H01Q1/12 ,  H01Q9/04 ,  H01Q9/0407

摘要： Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.

公开(公告)号：US20220225536A1

公开(公告)日：2022-07-14

申请号：US17711821

申请日：2022-04-01

申请人： The Intel Corporation

发明人： Arunpandi R. ,  Kathiravan D ,  Triplicane Gopikrishnan Babu ,  Doddi Raghavendra ,  Ritu Bawa ,  Bijendra Singh

IPC分类号： H05K7/20 ,  G06F1/20

摘要： Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.

公开(公告)号：US20190041922A1

公开(公告)日：2019-02-07

申请号：US16052590

申请日：2018-08-01

申请人： Intel Corporation

发明人： Prakash Kurma Raju ,  Babu Triplicane Gopikrishnan ,  Bijendra Singh ,  Prasanna Pichumani ,  Doddi Raghavendra ,  Harish Jagadish ,  Gopinath Kandasamy ,  David Pidwerbecki

IPC分类号： G06F1/20 ,  G06F1/16 ,  H05K7/20

摘要： There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.