公开(公告)号：US20240006283A1

公开(公告)日：2024-01-04

申请号：US17853487

申请日：2022-06-29

Applicant: Intel Corporation

Inventor： Suddhasattawa NAD ,  Rahul N. MANEPALLI ,  Gang DUAN ,  Srinivas V. PIETAMBARAM ,  Yi YANG ,  Marcel WALL ,  Darko GRUJICIC ,  Haobo CHEN ,  Aaron GARELICK

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L23/49866 ,  H01L21/4857 ,  H01L2224/16225 ,  H01L24/16

Abstract: Embodiments disclosed herein include package substrates and methods of forming such substrates. In an embodiment, a package substrate comprises a core, a first layer over the core, where the first layer comprises a metal, and a second layer over the first layer, where the second layer comprises an electrical insulator. In an embodiment, the package substrate further comprises a third layer over the second layer, where the third layer comprises a dielectric material, and where an edge of the core extends past edges of the first layer, the second layer, and the third layer.