公开(公告)号：US20180276176A1

公开(公告)日：2018-09-27

申请号：US15641186

申请日：2017-07-03

申请人： Intel Corporation

发明人： Timothy Wig ,  Umair I. Khan

IPC分类号： G06F13/42 ,  G06F13/40

CPC分类号： G06F13/4282 ,  G06F13/4068 ,  G06F2213/0026 ,  H01R13/6471 ,  H01R13/6474 ,  H05K1/0222 ,  H05K1/115 ,  H05K3/366 ,  H05K2201/09227 ,  H05K2201/09709 ,  H05K2201/10303

摘要： Embodiments are directed to systems and device that include a printed circuit board (PCB) and a through-hole pin-field. The pin-field includes a plurality of ground through-holes arranged along a centerline; a plurality of ground pins, each of the plurality of ground pins coupled to a corresponding ground through-hole; a first signal though-hole arranged on a first side of the centerline; a second signal through-hole arrange on a second side of the centerline, the first side oppose the second side; a first signal pin electrically connected to the PCB through the first signal through-hole, the first signal pin comprising a bend in a first direction and disposed proximate the first through-hole; and a second signal pin electrically connected to the PCB through the second signal through-hole, the second signal pin comprising a bend in a second direction opposite the first direction and disposed proximate the second through-hole.