公开(公告)号：US10249588B2

公开(公告)日：2019-04-02

申请号：US15369815

申请日：2016-12-05

Applicant: Intel Corporation

Inventor： Valery M. Dubin ,  Sridhar Balakrishnan ,  Mark Bohr

IPC: H01L23/00 ,  H01L21/288 ,  H01L21/48

Abstract: Methods, techniques, and structures relating to die packaging. In one exemplary implementation, a die package interconnect structure includes a semiconductor substrate and a first conducting layer in contact with the semiconductor substrate. The first conducting layer may include a base layer metal. The base layer metal may include Cu. The exemplary implementation may also include a diffusion barrier in contact with the first conducting layer and a wetting layer on top of the diffusion barrier. A bump layer may reside on top of the wetting layer, in which the bump layer may include Sn, and Sn may be electroplated. The diffusion barrier may be electroless and may be adapted to prevent Cu and Sn from diffusing through the diffusion barrier. Furthermore, the diffusion barrier may be further adapted to suppress a whisker-type formation in the bump layer.

公开(公告)号：US10035147B2

公开(公告)日：2018-07-31

申请号：US14587304

申请日：2014-12-31

Applicant: Intel Corporation

Inventor： Valery M. Dubin ,  Nikolay Suetin

IPC: G01N27/26 ,  G01N33/543 ,  B01J19/00 ,  B01L3/00 ,  G01N27/327

CPC classification number: B01L3/502715 ,  B01J19/0046 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00626 ,  B01J2219/00628 ,  B01J2219/00644 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01L2300/0645 ,  B82Y30/00 ,  C12Q1/001 ,  G01N27/3277 ,  G01N33/5436 ,  G01N33/5438

Abstract: An embodiment of the invention relates to a wafer comprising a plurality of biochips and interconnects on the wafer, the biochip comprising a biochip pad, a synthesis electrode and a gel comprising a probe, wherein a plurality of the biochip pads of the plurality of the biochips are interconnected by the interconnects to carry out a chemical reaction on a plurality of the synthesis electrodes.

公开(公告)号：US11201129B2

公开(公告)日：2021-12-14

申请号：US16283582

申请日：2019-02-22

Applicant: Intel Corporation

Inventor： Valery M. Dubin ,  Sridhar Balakrishnan ,  Mark Bohr

IPC: H01L23/00 ,  H01L21/288 ,  H01L21/48

Abstract: Methods, techniques, and structures relating to die packaging. In one exemplary implementation, a die package interconnect structure includes a semiconductor substrate and a first conducting layer in contact with the semiconductor substrate. The first conducting layer may include a base layer metal. The base layer metal may include Cu. The exemplary implementation may also include a diffusion barrier in contact with the first conducting layer and a wetting layer on top of the diffusion barrier. A bump layer may reside on top of the wetting layer, in which the bump layer may include Sn, and Sn may be electroplated. The diffusion barrier may be electroless and may be adapted to prevent Cu and Sn from diffusing through the diffusion barrier. Furthermore, the diffusion barrier may be further adapted to suppress a whisker-type formation in the bump layer.

公开(公告)号：US20150231633A1

公开(公告)日：2015-08-20

申请号：US14587304

申请日：2014-12-31

Applicant: Intel Corporation

Inventor： Valery M. Dubin ,  Nikolay Suetin

IPC: B01L3/00 ,  G01N27/327

CPC classification number: B01L3/502715 ,  B01J19/0046 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00626 ,  B01J2219/00628 ,  B01J2219/00644 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01L2300/0645 ,  B82Y30/00 ,  C12Q1/001 ,  G01N27/3277 ,  G01N33/5436 ,  G01N33/5438

Abstract: An embodiment of the invention relates to a biochip comprising at least two measurement electrodes, a synthesis electrode, a ground electrode, a gap between the at least two measurement electrodes, a porous dielectric isolation layer and a gel comprising a probe in the gap, wherein the porous dielectric isolation layer is between the synthesis electrode and the gel. Yet other embodiments relate to the method of manufacturing the biochip and using the biochip for electrical detection of bio-species.

Abstract translation: 本发明的实施例涉及一种生物芯片，其包括至少两个测量电极，合成电极，接地电极，至少两个测量电极之间的间隙，多孔电介质隔离层和在间隙中包含探针的凝胶，其中 多孔介电隔离层位于合成电极和凝胶之间。 其他实施方案涉及制造生物芯片的方法，并且使用用于生物物种的电检测的生物芯片。