公开(公告)号：US12058847B2

公开(公告)日：2024-08-06

申请号：US16888910

申请日：2020-06-01

申请人： Intel Corporation

发明人： Prashant Majhi ,  Abhishek A. Sharma ,  Charles Kuo ,  Brian S. Doyle ,  Urusa Shahriar Alaan ,  Van H Le ,  Elijah V. Karpov ,  Kaan Oguz ,  Arnab Sen Gupta

IPC分类号： H10B12/00 ,  H01L25/065

CPC分类号： H10B12/30 ,  H01L25/0657

摘要： Embodiments may relate to a microelectronic package that includes a first plurality of memory cells of a first type coupled with a substrate. The microelectronic package may further include a second plurality of memory cells of a second type communicatively coupled with the substrate such that the first plurality of memory cells is between the substrate and the second plurality of memory cells. Other embodiments may be described or claimed.