公开(公告)号：US20230245940A1

公开(公告)日：2023-08-03

申请号：US18133868

申请日：2023-04-12

Applicant: Intel Corporation

Inventor： Rahul JAIN ,  Kyu Oh LEE ,  Siddharth K. ALUR ,  Wei-Lun K. JEN ,  Vipul V. MEHTA ,  Ashish DHALL ,  Sri Chaitra J. CHAVALI ,  Rahul N. MANEPALLI ,  Amruthavalli P. ALUR ,  Sai VADLAMANI

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L23/532 ,  H01L23/498

CPC classification number: H01L23/3185 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L23/53295 ,  H01L23/3128 ,  H01L24/06 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2924/18161 ,  H01L2224/83051 ,  H01L2224/81

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

公开(公告)号：US20240186202A1

公开(公告)日：2024-06-06

申请号：US18415268

申请日：2024-01-17

Applicant: Intel Corporation

Inventor： Rahul JAIN ,  Kyu Oh LEE ,  Siddharth K. ALUR ,  Wei-Lun K. JEN ,  Vipul V. MEHTA ,  Ashish DHALL ,  Sri Chaitra J. CHAVALI ,  Rahul N. MANEPALLI ,  Amruthavalli P. ALUR ,  Sai VADLAMANI

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/532 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/3185 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/53295 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2224/81 ,  H01L2224/83051 ,  H01L2924/18161

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.