公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.