公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

公开(公告)号：US20190246488A1

公开(公告)日：2019-08-08

申请号：US16370506

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Evan Piotr Kuklinski ,  Jerrod Peterson ,  Ruander Cardenas ,  Patrick Douglas James

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  F28F2013/006 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/10734

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a printed circuit board, a heat source located on the printed circuit board, and an active loading mechanism secured to the printed circuit board. The active loading mechanism is over the heat source and includes shape memory material. When the shape memory material is not activated, the active loading mechanism applies a first load on the heat source and when the shape memory material is activated, the active loading mechanism applies a second load on the heat source.

公开(公告)号：US12193149B2

公开(公告)日：2025-01-07

申请号：US17132329

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Sami Markus Heinisuo ,  Evan Piotr Kuklinski ,  Kari Pekka Johannes Mansukoski ,  Shawn McEuen

IPC: H05K1/02 ,  H01L23/60

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.

公开(公告)号：US20210153339A1

公开(公告)日：2021-05-20

申请号：US17132329

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Sami Markus Heinisuo ,  Evan Piotr Kuklinski ,  Kari Pekka Johannes Mansukoski ,  Shawn McEuen

IPC: H05K1/02 ,  H01L23/60

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.