公开(公告)号：US20020074649A1

公开(公告)日：2002-06-20

申请号：US09737117

申请日：2000-12-14

Applicant: Intel Corporation

Inventor： Gregory M. Chrysler ,  Abhay A. Watwe

IPC: H01L023/34

CPC classification number: H01L23/36 ,  H01L23/3732 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract translation: 为了适应与高性能集成电路相关联的高功率密度，集成电路封装包括散热结构，其中热量通过形成的高容量热界面从一个或多个管芯的表面散发到集成散热器（IHS） 金刚石，金刚石复合材料或石墨。 在一个实施方案中，在IHS上生长金刚石层。 在另一个实施方案中，分开形成金刚石层并固定在IHS上。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US20040082188A1

公开(公告)日：2004-04-29

申请号：US10655728

申请日：2003-09-05

Applicant: Intel Corporation

Inventor： Gregory M. Chrysler ,  Abhay A. Watwe

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01L23/36 ,  H01L23/3732 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In an embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract translation: 为了适应与高性能集成电路相关联的高功率密度，集成电路封装包括散热结构，其中热量通过形成的高容量热界面从一个或多个管芯的表面散发到集成散热器（IHS） 金刚石，金刚石复合材料或石墨。 在一个实施方案中，在IHS上生长金刚石层。 在另一个实施方案中，分开形成金刚石层并固定在IHS上。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US20020080584A1

公开(公告)日：2002-06-27

申请号：US09970954

申请日：2001-10-04

Applicant: Intel Corporation.

Inventor： Ravi Prasher ,  Abhay A. Watwe ,  Gregory M. Chrysler ,  Kristopher Frutschy ,  Leo Ofman ,  Ajit V. Sathe

IPC: H05K007/20

CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.