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公开(公告)号:US09954130B2
公开(公告)日:2018-04-24
申请号:US15061110
申请日:2016-03-04
Applicant: Intellectual Keystone Technology LLC
Inventor: Sung-Chul Lee , Doo-Youl Lee , Young-Jin Kim , Young-Su Kim , Young-Soo Kim , Dong-Hun Lee
IPC: H01L31/0232 , H01L31/065 , H01L31/0224 , H01L31/068 , H01L31/18 , H01L31/0216
CPC classification number: H01L31/065 , H01L31/02168 , H01L31/022441 , H01L31/0682 , H01L31/1804 , Y02E10/547 , Y02P70/521
Abstract: A method of fabricating a solar cell includes forming a doped portion having a first conductive type on a semiconductor substrate, growing an oxide layer on the semiconductor substrate, forming a plurality of recess portions in the oxide layer, further growing the oxide layer on the semiconductor substrate, forming a doped portion having a second conductive type on areas of the semiconductor substrate corresponding to the recess portions, forming a first conductive electrode electrically coupled to the doped portion having the first conductive type, and forming a second conductive electrode on the semiconductor substrate and electrically coupled to the doped portion having the second conductive type, wherein a gap between the doped portions having the first and second conductive types corresponds to a width of the oxide layer formed by further growing the oxide layer.
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公开(公告)号:US20160190374A1
公开(公告)日:2016-06-30
申请号:US15061110
申请日:2016-03-04
Applicant: Intellectual Keystone Technology LLC
Inventor: Sung-Chul Lee , Doo-Youl Lee , Young-Jin Kim , Young-Su Kim , Young-Soo Kim , Dong-Hun Lee
IPC: H01L31/065 , H01L31/0216
CPC classification number: H01L31/065 , H01L31/02168 , H01L31/022441 , H01L31/0682 , H01L31/1804 , Y02E10/547 , Y02P70/521
Abstract: A method of fabricating a solar cell includes forming a doped portion having a first conductive type on a semiconductor substrate, growing an oxide layer on the semiconductor substrate, forming a plurality of recess portions in the oxide layer, further growing the oxide layer on the semiconductor substrate, forming a doped portion having a second conductive type on areas of the semiconductor substrate corresponding to the recess portions, forming a first conductive electrode electrically coupled to the doped portion having the first conductive type, and forming a second conductive electrode on the semiconductor substrate and electrically coupled to the doped portion having the second conductive type, wherein a gap between the doped portions having the first and second conductive types corresponds to a width of the oxide layer formed by further growing the oxide layer.
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