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1.发明申请Low temperature solder column attach by injection molded solder and structure formed 审中-公开低温焊料柱通过注塑焊料附着并形成结构公开(公告)号：US20020023945A1
公开(公告)日：2002-02-28
申请号：US09862371
申请日：2001-05-22
发明人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
IPC分类号： B23K031/02 , B23K035/24 , B23K035/14 , B05D001/32 , B05D005/12
CPC分类号： H05K3/3468 , B23K3/0638 , B23K35/0222 , B23K2101/40 , H01L21/4846 , H05K2203/0113 , H05K2203/0338 , H05K2203/0415 , H05K2203/074 , H05K2203/128
摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.
摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。
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公开(公告)号：US20040261261A1
公开(公告)日：2004-12-30
申请号：US10604150
申请日：2003-06-27
IPC分类号： H01R043/00 , B23P019/00
CPC分类号： H01L21/67144 , Y10T29/49117 , Y10T29/49139 , Y10T29/49822 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： An apparatus for removing attached die having a pivoting means, having a pivot point and first and second sides, the pivot point having a corresponding first y coordinate, the first and second sides positioned opposite to one another, said pivoting means capable of attaching to a die carrier. The apparatus also having a shaft attached to the first side of the pivoting means. The apparatus further having a counterweight attached to the second side of the pivoting means. The apparatus lastly having a clamping means capable of attaching to at least one die, the die having a corresponding second y coordinate, wherein the first y coordinate is greater than the second y coordinate.
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公开(公告)号：US20040041011A1
公开(公告)日：2004-03-04
申请号：US10235007
申请日：2002-09-03
IPC分类号： B23K001/018
CPC分类号： H01L21/67144 , B23K1/018
摘要： A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
摘要翻译： 公开了一种用于将芯片从衬底上分离的方法和结构，其将剪切力的传递延迟到芯片，直到将芯片附接到衬底的连接器足够柔软，使得剪切力的传递不会损坏芯片的连接器。 更具体地，剪切力由双金属盘产生，当加热时，双金属盘被转化为剪切力。 剪切力由延迟装置延迟，直到将芯片连接到基板的连接器足够柔软，使得施加剪切力将使芯片与基板分离而不损坏芯片的连接器。 该延迟装置包括物理间隙，该物理间隙可以被调整以控制何时施加剪切力到芯片。
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