公开(公告)号：US20020094940A1

公开(公告)日：2002-07-18

申请号：US09760939

申请日：2001-01-16

申请人： International Business Machines Corporation

发明人： Krishna G. Sachdev ,  Chon C. Lei

IPC分类号： C11D001/00

CPC分类号： H01L21/4864 ,  C11D7/263 ,  C11D7/266 ,  C11D7/5022 ,  C11D11/0047 ,  H01L21/4835 ,  H05K3/26 ,  H05K2203/0783

摘要： This invention provides a method for removing flux residue and similar other residues formed on the surfaces of microelectronic components during soldering operations using solder paste and fluxing agents in electronic module assembly component fabrication by a semi-aqueous solvent cleaning process using propylene glycol alkyl ether solvents, preferably the mono alkyl ethers, as replacements for xylene. The electronic components may contain plastic components, for example, a plastic grid array (PBGA) in addition to silicon device chip(s), C4 decaps and SMTs on a ceramic chip carrier with solder columns. Preferred solvents are dipropylene glycol mono methyl ether and tripropylene glycol mono methyl ether, which are both water soluble.

摘要翻译： 本发明提供了一种在使用丙二醇烷基醚溶剂的半水溶剂清洗方法制造电子模块组件组件时，使用焊膏和助熔剂在焊接操作期间除去形成在微电子部件表面上的助焊剂残留物和类似的其它残留物的方法， 优选单烷基醚，作为二甲苯的替代物。 除了硅器件芯片之外，电子部件可以包含塑料部件，例如除了硅器件芯片之外的塑料栅格阵列（PBGA），具有焊料柱的陶瓷芯片载体上的C4折叠和SMT。 优选的溶剂是二丙二醇单甲醚和三丙二醇单甲醚，它们都是水溶性的。

公开(公告)号：US20020023945A1

公开(公告)日：2002-02-28

申请号：US09862371

申请日：2001-05-22

申请人： International Business Machines Corporation

发明人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

IPC分类号： B23K031/02 ,  B23K035/24 ,  B23K035/14 ,  B05D001/32 ,  B05D005/12

CPC分类号： H05K3/3468 ,  B23K3/0638 ,  B23K35/0222 ,  B23K2101/40 ,  H01L21/4846 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/074 ,  H05K2203/128

摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.

摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。