Abstract:
A reconfigurable multi-stack inductor formed within a semiconductor structure may include a first inductor structure located within a first metal layer of the semiconductor structure, a first ground shielding structure located within the first metal layer that is electrically isolated from and circumferentially bounds the first inductor structure, and a second inductor structure located within a second metal layer of the semiconductor structure, whereby the second inductor structure is electrically coupled to the first inductor structure. A second ground shielding structure located within the second metal layer is electrically isolated from and circumferentially bounds the second inductor structure, whereby the first and second inductor generate a first inductance value based on the first ground shielding structure and second ground shielding structure being coupled to ground, and the first and second inductor generate a second inductance value based on the first ground shielding structure and second ground shielding structure electrically floating.
Abstract:
An enhanced negative resistance voltage controlled oscillator (VCO) is provided, in which the body of each transistor within a pair of cross-coupled transistors is coupled to the gate of the same transistor through a resistor. The body transconductance is employed to enhance the negative resistance of the cross-coupled pair of transistors. At the same time, a forward body bias voltage reduces the threshold voltage of the cross-coupled pair to allow the VCO to operate at a low power supply voltage. Further, the resistor connected between the body and the drain of each transistor voids the leakage in the substrate, and thus, reduces power consumption of the VCO further. This VCO provides low power operation with enhanced figure of merit without employing any extra inductors besides the inductors that are part of the LC tank.
Abstract:
A reconfigurable multi-stack inductor formed within a semiconductor structure may include a first inductor structure located within a first metal layer of the semiconductor structure, a first ground shielding structure located within the first metal layer that is electrically isolated from and circumferentially bounds the first inductor structure, and a second inductor structure located within a second metal layer of the semiconductor structure, whereby the second inductor structure is electrically coupled to the first inductor structure. A second ground shielding structure located within the second metal layer is electrically isolated from and circumferentially bounds the second inductor structure, whereby the first and second inductor generate a first inductance value based on the first ground shielding structure and second ground shielding structure being coupled to ground, and the first and second inductor generate a second inductance value based on the first ground shielding structure and second ground shielding structure electrically floating.
Abstract:
An enhanced negative resistance voltage controlled oscillator (VCO) circuit is provided, in which a parallel connection of a capacitor and a resistor configured to provide frequency-dependent transconductance is present across source nodes of a first pair of field effect transistors in which gate nodes and drain nodes are cross-coupled. The source nodes of the first pair of field effect transistors are electrically shorted to drain nodes of a second pair of field effect transistors of which the gate nodes are electrically shorted to the gate nodes of the first pair of field effect transistors. The parallel connection of the capacitor and the resistor includes a parallel connection of a capacitor and a resistor such that the net transconductance of the first pair of field effect transistors is less at low frequencies where thermal noise and flicker noise are dominant part of the phase noise than at the operational frequency range.
Abstract:
A reconfigurable multi-stack inductor formed within a semiconductor structure may include a first inductor structure located within a first metal layer of the semiconductor structure, a first ground shielding structure located within the first metal layer that is electrically isolated from and circumferentially bounds the first inductor structure, and a second inductor structure located within a second metal layer of the semiconductor structure, whereby the second inductor structure is electrically coupled to the first inductor structure. A second ground shielding structure located within the second metal layer is electrically isolated from and circumferentially bounds the second inductor structure, whereby the first and second inductor generate a first inductance value based on the first ground shielding structure and second ground shielding structure being coupled to ground, and the first and second inductor generate a second inductance value based on the first ground shielding structure and second ground shielding structure electrically floating.
Abstract:
A three-dimensionally (3d) confined conductor advantageously used as an electronic fuse and self-aligned methods of forming the same. By non-conformal deposition of a dielectric film over raised structures, a 3d confined tube, which may be sub-lithographic, is formed between the raised structures. Etching holes which intersect the 3d confined region and subsequent metal deposition fills the 3d confined region and forms contacts. When the raised structures are gates, the fuse element may be located at the middle of the line (i.e. in pre-metal dielectric). Other methods for creating the structure are also described.
Abstract:
A capacitor structure can include a parallel connection of a plurality of trench capacitors. First nodes of the plurality of trench capacitors are electrically tied to provide a first node of the capacitor structure. Second nodes of the plurality of trench capacitors are electrically tied together through at least one programmable electrical connection at a second node of the capacitor structure. Each programmable electrical connection can include at least one of a programmable electrical fuse and a field effect transistor, and can disconnect a corresponding trench capacitor temporarily or permanently. The total capacitance of the capacitor structure can be tuned by programming, temporarily or permanently, the at least one programmable electrical connection.
Abstract:
An enhanced negative resistance voltage controlled oscillator (VCO) circuit is provided, in which a parallel connection of a capacitor and a resistor configured to provide frequency-dependent transconductance is present across source nodes of a first pair of field effect transistors in which gate nodes and drain nodes are cross-coupled. The source nodes of the first pair of field effect transistors are electrically shorted to drain nodes of a second pair of field effect transistors of which the gate nodes are electrically shorted to the gate nodes of the first pair of field effect transistors. The parallel connection of the capacitor and the resistor includes a parallel connection of a capacitor and a resistor such that the net transconductance of the first pair of field effect transistors is less at low frequencies where thermal noise and flicker noise are dominant part of the phase noise than at the operational frequency range.
Abstract:
An electronic fuse link with lower programming current for high performance and self-aligned methods of forming the same. The invention provides a horizontal e-fuse structure in the middle of the line. A reduced fuse link width is achieved by spacers on sides of pair of dummy or active gates, to create sub-lithographic dimension between gates with spacers to confine a fuse link. A reduced height in the third dimension on the fuse link achieved by etching the link, thereby creating a fuse link having a sub-lithographic size in all dimensions. The fuse link is formed over an isolation region to enhanced heating and aid fuse blow.
Abstract:
A reconfigurable multi-stack inductor formed within a semiconductor structure may include a first inductor structure located within a first metal layer of the semiconductor structure, a first ground shielding structure located within the first metal layer that is electrically isolated from and circumferentially bounds the first inductor structure, and a second inductor structure located within a second metal layer of the semiconductor structure, whereby the second inductor structure is electrically coupled to the first inductor structure. A second ground shielding structure located within the second metal layer is electrically isolated from and circumferentially bounds the second inductor structure, whereby the first and second inductor generate a first inductance value based on the first ground shielding structure and second ground shielding structure being coupled to ground, and the first and second inductor generate a second inductance value based on the first ground shielding structure and second ground shielding structure electrically floating.