IMPLEMENTING LOW TEMPERATURE WAFER TEST
    3.
    发明申请
    IMPLEMENTING LOW TEMPERATURE WAFER TEST 有权
    实施低温波浪测试

    公开(公告)号:US20150061712A1

    公开(公告)日:2015-03-05

    申请号:US14010657

    申请日:2013-08-27

    CPC classification number: G01R31/2831 G01R31/2877

    Abstract: A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and testing is performed.

    Abstract translation: 提供了一种用于实现完成晶片的低温晶片测试的方法和结构。 将冷却剂凝胶施加到完成的晶片上,将凝胶涂覆的晶片冷却,并且将一个或多个电测试探针通过凝胶施加到冷却的晶片的电触点,并进行测试。

    RECYCLATE VERIFICATION
    4.
    发明申请
    RECYCLATE VERIFICATION 有权
    重新验证

    公开(公告)号:US20160202233A1

    公开(公告)日:2016-07-14

    申请号:US14682147

    申请日:2015-04-09

    Abstract: A composition for recyclate verification is produced by adding a predetermined quantity of one or more verification compounds to a base resin. Each of the verification compounds is thermally stable over a range of temperatures that includes the maximum processing temperature of the base resin but is less than the degradation temperature of the base resin. In some embodiments, a thermoplastic material provided for verification as a recyclate is analyzed to detect the presence (and, optionally, the loading level) of one or more verification compounds associated with the base resin of the thermoplastic material. In some embodiments, a computer-implemented method for recyclate verification is performed using a computer program product. In some embodiments, a thermoplastic material verified as a recyclate is heated to drive off the verification compound(s), then a known quantity of the verification compound(s) is added to the recyclate, which is then blended with virgin base resin material.

    Abstract translation: 通过将预定量的一种或多种验证化合物加入到基础树脂中来产生用于再循环验证的组合物。 每个验证化合物在包括基础树脂的最大加工温度但小于基础树脂的降解温度的温度范围内是热稳定的。 在一些实施方案中,分析提供用于作为回收物验证的热塑性材料以检测与热塑性材料的基础树脂相关联的一种或多种验证化合物的存在(和任选地,加载水平)。 在一些实施例中,使用计算机程序产品执行用于回收验证的计算机实现的方法。 在一些实施方案中,将作为回收物验证的热塑性材料加热以驱离验证化合物,然后将已知量的验证化合物加入到再循环中,然后将其与原始基础树脂材料混合。

    Implementing low temperature wafer test
    5.
    发明授权
    Implementing low temperature wafer test 有权
    实施低温晶圆试验

    公开(公告)号:US09335367B2

    公开(公告)日:2016-05-10

    申请号:US14010657

    申请日:2013-08-27

    CPC classification number: G01R31/2831 G01R31/2877

    Abstract: A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and testing is performed.

    Abstract translation: 提供了一种用于实现完成晶片的低温晶片测试的方法和结构。 将冷却剂凝胶施加到完成的晶片上,将凝胶涂覆的晶片冷却,并且将一个或多个电测试探针通过凝胶施加到冷却的晶片的电触点,并进行测试。

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