公开(公告)号：US20170148647A1

公开(公告)日：2017-05-25

申请号：US15424297

申请日：2017-02-03

申请人： International Business Machines Corporation ,  STMicroelectronics, Inc.

发明人： John H. Zhang ,  Laertis Economikos ,  Adam Ticknor ,  Wei-Tsu Tseng

IPC分类号： H01L21/67 ,  B01D61/18 ,  B08B7/00 ,  B01D53/22 ,  B08B3/14 ,  B01D15/36 ,  B01D53/82

CPC分类号： H01L21/67017 ,  B01D15/362 ,  B01D15/363 ,  B01D24/002 ,  B01D24/008 ,  B01D53/82 ,  B01D2201/287 ,  B01D2221/14 ,  B01D2253/206 ,  B01D2258/0216 ,  H01L21/6704 ,  H01L21/67051

摘要： The present disclosure is directed to fluid filtering systems and methods for use during semiconductor processing. One or more embodiments are directed to fluid filtering systems and methods for filtering ions and particles from a fluid as the fluid is being provided to a semiconductor wafer processing tool, such as to a semiconductor wafer cleaning tool.

公开(公告)号：US10109505B2

公开(公告)日：2018-10-23

申请号：US15424297

申请日：2017-02-03

申请人： International Business Machines Corporation ,  STMicroelectronics, Inc.

发明人： John H. Zhang ,  Laertis Economikos ,  Adam Ticknor ,  Wei-Tsu Tseng

IPC分类号： H01L21/67 ,  B01D15/36 ,  B01D24/00

摘要： The present disclosure is directed to fluid filtering systems and methods for use during semiconductor processing. One or more embodiments are directed to fluid filtering systems and methods for filtering ions and particles from a fluid as the fluid is being provided to a semiconductor wafer processing tool, such as to a semiconductor wafer cleaning tool.