-
公开(公告)号：US12013282B2
公开(公告)日：2024-06-18
申请号：US17818820
申请日：2022-08-10
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Kieran Harney
CPC classification number: G01H3/00 , B81B3/0018 , B81B7/0061 , B81B2201/0257 , G01H11/06 , H04R19/005 , H04R31/006 , H04R2201/003
Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.
-
公开(公告)号：US20240048249A1
公开(公告)日：2024-02-08
申请号：US18360463
申请日：2023-07-27
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Stephen Bart
IPC: H04B11/00
CPC classification number: H04B11/00
Abstract: Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simultaneously, and a processing circuitry configured to adjust a configuration parameter associated with the MEMS microphone device based on the ultrasonic signal.
-
公开(公告)号：US20230188904A1
公开(公告)日：2023-06-15
申请号：US18063374
申请日：2022-12-08
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker
IPC: H04R19/04
CPC classification number: H04R19/04 , H04R2201/003
Abstract: The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
-
公开(公告)号：US20220381605A1
公开(公告)日：2022-12-01
申请号：US17818820
申请日：2022-08-10
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Kieran Harney
Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.
-
公开(公告)号：US20180091900A1
公开(公告)日：2018-03-29
申请号：US15280607
申请日：2016-09-29
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Sushil Bharatan , Erhan Polatkan Ata
CPC classification number: H04R3/06 , H04R19/005 , H04R19/01 , H04R19/04 , H04R29/004 , H04R2201/003
Abstract: Microphone distortion reduction is presented herein. A system can comprise: a processor; and a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations, comprising: obtaining a pressure-in to voltage-out transfer function representing a distortion of an output of a microphone corresponding to a stimulus of a defined sound pressure level that has been applied to the microphone; inverting an equation representing the pressure-in to voltage-out transfer function to obtain an inverse transfer function; and applying the inverse transfer function to the output to obtain a linearized output representing the stimulus. In one example, the obtaining of the pressure-in to voltage-out transfer function comprises: creating an ideal sine wave stimulus comprising the amplitude and fundamental frequency of the time domain waveform; and generating the equation based on a defined relationship between the ideal sine wave stimulus and the time domain waveform.
-
Patent Agency Ranking
公开(公告)号：US20250106567A1
公开(公告)日：2025-03-27
申请号：US18973650
申请日：2024-12-09
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker
IPC: H04R19/04
Abstract: The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
-
公开(公告)号：US12192704B2
公开(公告)日：2025-01-07
申请号：US18063374
申请日：2022-12-08
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker
IPC: H04R19/04
Abstract: The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
-
公开(公告)号：US11012790B2
公开(公告)日：2021-05-18
申请号：US16543076
申请日：2019-08-16
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Kazunori Hayata
Abstract: A system and method for the manufacture of flipchip microelectromechanical system devices. A method comprises forming a cavity from a first surface of a rigid back through to a second surface of the rigid back, depositing an anisotropic conductive film over the first surface of the multilayer rigid back to conform to a contour of a microelectromechanical system device, positioning the a microelectromechanical system device over the cavity formed in the multilayered rigid back, and causing contact of the microelectromechanical system device with the anisotropic conductive film deposited over the first surface of the multilayer rigid back.
-
公开(公告)号：US09980046B2
公开(公告)日：2018-05-22
申请号：US15280607
申请日：2016-09-29
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Sushil Bharatan , Erhan Polatkan Ata
CPC classification number: H04R3/06 , H04R19/005 , H04R19/01 , H04R19/04 , H04R29/004 , H04R2201/003
Abstract: Microphone distortion reduction is presented herein. A system can comprise: a processor; and a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations, comprising: obtaining a pressure-in to voltage-out transfer function representing a distortion of an output of a microphone corresponding to a stimulus of a defined sound pressure level that has been applied to the microphone; inverting an equation representing the pressure-in to voltage-out transfer function to obtain an inverse transfer function; and applying the inverse transfer function to the output to obtain a linearized output representing the stimulus. In one example, the obtaining of the pressure-in to voltage-out transfer function comprises: creating an ideal sine wave stimulus comprising the amplitude and fundamental frequency of the time domain waveform; and generating the equation based on a defined relationship between the ideal sine wave stimulus and the time domain waveform.
-
公开(公告)号：US12287280B2
公开(公告)日：2025-04-29
申请号：US17890016
申请日：2022-08-17
Applicant: InvenSense, Inc.
Inventor： Jeremy Parker , Nishit Goel , Stephen Bart
Abstract: A bi-directional photoacoustic gas sensor includes a first photoacoustic cell, where an electromagnetic radiation source emits radiation to interact with an external gas and generate pressure waves that are detected by a MEMS diaphragm. A second photoacoustic cell has an interior volume and acoustic compliance that corresponds to the interior volume and acoustic compliance of the first photoacoustic cell. Processing circuitry within a substrate uses a first acoustic signal, received by the first photoacoustic cell, and a second acoustic signal, received by the second photoacoustic cell, to determine a bi-directional response of the gas sensor to remove noise and improve the sensor's signal-to-noise ratio.
-
-
-
-
-
-
-
-
-
Search Results
19
records
(took 0.014 seconds)
