公开(公告)号：US20140264655A1

公开(公告)日：2014-09-18

申请号：US14061152

申请日：2013-10-23

Applicant: InvenSense, Inc.

Inventor： Kirt Reed WILLIAMS ,  Kegang HUANG ,  Wencheng XU ,  Jongwoo SHIN ,  Martin LIM

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81C2201/115

Abstract: In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness.

Abstract translation: 在集成的MEMS器件中，移动具有光滑表面的硅部件如果接触则可以粘在一起。 通过使至少一个光滑表面粗糙化，有效的接触面积以及因此的表面附着能减少，因此粘附力降低。 可以通过以局部不均匀蚀刻速率蚀刻气体，等离子体或液体中的光滑表面来提供表面的粗糙化。 各种蚀刻化学和条件导致各种表面粗糙度。