公开(公告)号：US20180196082A1

公开(公告)日：2018-07-12

申请号：US15916105

申请日：2018-03-08

Applicant: InvenSense, Inc.

Inventor： Matthew Julian THOMPSON ,  Kirt Reed WILLIAMS

IPC: G01P15/125 ,  B81B7/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B3/0086 ,  B81B7/0016 ,  B81B2201/025 ,  B81B2203/0307 ,  B81B2203/04 ,  G01P2015/0831

Abstract: A MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, wherein the sensing reference plane is divided by a first and a second axis forming four quadrants on the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, and a pattern of sensing elements on the sensing reference plane to detect motion normal of the at least one proof mass relative to the sensing reference plane, wherein the pattern of sensing elements comprises at least three sensing elements in each of the four quadrants.

公开(公告)号：US20150076631A1

公开(公告)日：2015-03-19

申请号：US14225275

申请日：2014-03-25

Applicant: InvenSense, Inc.

Inventor： Jongwoo SHIN ,  Kirt Reed WILLIAMS ,  Cerina ZHANG ,  Kuolung (Dino) LEI

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00103 ,  B81C2201/0112 ,  B81C2201/0132 ,  B81C2201/0133

Abstract: A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE.

Abstract translation: MEMS（微机电系统）结构包括MEMS晶片。 MEMS晶片包括具有通过布置在盖和结构层之间的电介质层结合到结构层的空腔的盖。 阐述了MEMS器件的独特结构和提供这些器件的方法，其部分地通过使用多步骤深反应离子蚀刻（DRIE）形成蚀刻掩模光致抗蚀剂回流来形成圆形，扇形或倒角的MEMS轮廓， 不同的蚀刻特性，或通过DRIE后的蚀刻。

公开(公告)号：US20160334438A1

公开(公告)日：2016-11-17

申请号：US14714149

申请日：2015-05-15

Applicant: InvenSense, Inc.

Inventor： Matthew Julian THOMPSON ,  Kirt Reed WILLIAMS

IPC: G01P15/125 ,  B81B7/00

CPC classification number: G01P15/125 ,  B81B7/0016 ,  B81B2203/0307 ,  G01P2015/0831

Abstract: A system and method for reducing offset in a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, a pattern of sensing elements coupled between the sensing reference plane and the at least one proof mass to detect motion normal to the sensing reference plane, wherein the pattern of sensing elements shares at least three axes of polarity anti-symmetry, and a signal processing circuit to combine the pattern of sensing elements thereby providing an output proportional to the external excitation. In a second aspect, the sensing reference plane is divided by two axes forming four quadrants on the sensing reference plane.

Abstract translation: 公开了一种减小MEMS传感器偏移的系统和方法。 在第一方面，该系统是MEMS传感器，其包括感测参考平面，耦合到感测参考平面的至少一个锚固体，耦合到至少一个锚的至少一个证明块，其中至少一个证明中的一个 质量在外部激励下移动，感测元件的图案耦合在感测参考平面和至少一个证明质量块之间以检测垂直于感测参考平面的运动，其中感测元件的图案共享至少三个极性反转轴， 对称性和信号处理电路，以组合感测元件的图案，从而提供与外部激励成比例的输出。 在第二方面，感测参考平面由感测参考平面上形成四个象限的两个轴分开。

公开(公告)号：US20200064369A1

公开(公告)日：2020-02-27

申请号：US16673602

申请日：2019-11-04

Applicant: InvenSense, Inc.

Inventor： Matthew Julian THOMPSON ,  Kirt Reed WILLIAMS

IPC: G01P15/125 ,  B81B7/00

Abstract: A MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, wherein the sensing reference plane is divided by a first and a second axis forming four quadrants on the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, and a pattern of sensing elements on the sensing reference plane to detect motion normal of the at least one proof mass relative to the sensing reference plane, wherein the pattern of sensing elements comprises at least three sensing elements in each of the four quadrants.

公开(公告)号：US20140264655A1

公开(公告)日：2014-09-18

申请号：US14061152

申请日：2013-10-23

Applicant: InvenSense, Inc.

Inventor： Kirt Reed WILLIAMS ,  Kegang HUANG ,  Wencheng XU ,  Jongwoo SHIN ,  Martin LIM

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81C2201/115

Abstract: In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness.

Abstract translation: 在集成的MEMS器件中，移动具有光滑表面的硅部件如果接触则可以粘在一起。 通过使至少一个光滑表面粗糙化，有效的接触面积以及因此的表面附着能减少，因此粘附力降低。 可以通过以局部不均匀蚀刻速率蚀刻气体，等离子体或液体中的光滑表面来提供表面的粗糙化。 各种蚀刻化学和条件导致各种表面粗糙度。