公开(公告)号：US20160079093A1

公开(公告)日：2016-03-17

申请号：US14488187

申请日：2014-09-16

Applicant: Invensas Corporation

Inventor： Eric S. TOSAYA ,  Rajesh KATKAR ,  Liang WANG ,  Cyprian Emeka UZOH

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L21/481 ,  H01L23/13 ,  H01L23/3178 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/06102 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16237 ,  H01L2224/2908 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81395 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83

Abstract: A microelectronic component (110, 120) has a contact pad (110C, 120C, 920C) recessed in a cavity (410) and covered by underfill tape (130). The cavity has a void (410V) below the underfill tape. A protruding contact pad of another microelectronic component ruptures the underfill tape to enter the cavity and bond to the recessed contact pad. The void helps in rupturing the underfill tape, thus reducing the amount of underfill residue between the two contact pads and improving the contact resistance. Also provided is a microelectronic component having a substrate with a cavity and having a through-substrate via extending into the cavity. Other features are also provided.

Abstract translation: 微电子部件（110,120）具有凹陷在空腔（410）中并被底部填充带（130）覆盖的接触垫（110C，120C，920C）。 空腔在底部填充带下方具有空隙（410V）。 另一微电子元件的突出的接触垫破坏了底部填充带进入腔并结合到凹陷接触垫。 该空隙有助于破裂底部填充带，从而减少两个接触垫之间的底部填充残余物的量并改善接触电阻。 还提供了一种微电子部件，其具有带有空腔的基板，并且具有延伸到空腔中的贯穿基板。 还提供其他功能。