公开(公告)号：US07241701B2

公开(公告)日：2007-07-10

申请号：US10675049

申请日：2003-09-30

Applicant: Ioannis Dotsikas

Inventor： Ioannis Dotsikas

IPC: H01L21/31

CPC classification number: C23C16/45502 ,  C23C16/455 ,  H01L21/02532 ,  H01L21/0262

Abstract: A method and a furnace are provided for the vapor phase deposition of components onto semiconductor substrates. The main flow direction of the process gases can be varied or reversed by the furnace in the course of the method. This prevents temperature and concentration inhomogeneities of the process gas within the furnace, and permits the components to be uniformly deposited onto the semiconductor substrates.

Abstract translation: 提供了一种方法和炉子，用于将组分气相沉积到半导体衬底上。 在方法过程中，工艺气体的主要流动方向可以由炉改变或反转。 这可以防止炉内的工艺气体的温度和浓度不均匀性，并且允许将组分均匀地沉积到半导体衬底上。

公开(公告)号：US20060177969A1

公开(公告)日：2006-08-10

申请号：US11051257

申请日：2005-02-04

Applicant: Ioannis Dotsikas

Inventor： Ioannis Dotsikas

IPC: H01L21/44 ,  H01L21/50 ,  H01L23/48 ,  H01L23/52

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/90 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A semiconductor component includes a substrate having a plurality of compliant contact bumps formed over a surface thereof. A semiconductor chip has a plurality of contact regions formed over a surface thereof. The compliant contact bumps of the substrate are electrically connected with the contact regions of the semiconductor chip and wherein the semiconductor chip is mechanically attached to the substrate. As an example, this connection and attachment can be achieved by soldering the contact bumps to the contact regions.

Abstract translation: 半导体部件包括在其表面上形成有多个柔性接触凸块的基板。 半导体芯片具有在其表面上形成的多个接触区域。 衬底的柔性接触凸起与半导体芯片的接触区域电连接，并且其中半导体芯片机械地附接到衬底。 作为示例，可以通过将接触凸块焊接到接触区域来实现该连接和附接。

公开(公告)号：US07364999B2

公开(公告)日：2008-04-29

申请号：US11051257

申请日：2005-02-04

Applicant: Ioannis Dotsikas

Inventor： Ioannis Dotsikas

IPC: H01L21/488

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/90 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A semiconductor component includes a substrate having a plurality of compliant contact bumps formed over a surface thereof. A semiconductor chip has a plurality of contact regions formed over a surface thereof. The compliant contact bumps of the substrate are electrically connected with the contact regions of the semiconductor chip and wherein the semiconductor chip is mechanically attached to the substrate. As an example, this connection and attachment can be achieved by soldering the contact bumps to the contact regions.

Abstract translation: 半导体部件包括在其表面上形成有多个柔性接触凸块的基板。 半导体芯片具有在其表面上形成的多个接触区域。 衬底的柔性接触凸块与半导体芯片的接触区域电连接，并且其中半导体芯片机械地附接到衬底。 作为示例，可以通过将接触凸块焊接到接触区域来实现该连接和附接。